Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
New Equipment | Assembly Services
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
Electronics Forum | Thu Apr 10 19:19:01 EDT 2003 | stevemoore
Are you gluing the parts to the board? We had a similar situation where the glue beneath the component would add a 'fulcrum' point to the center of the device and when the board flexed the part would fracture.
Electronics Forum | Wed Jun 11 11:33:26 EDT 2014 | fredcalkins
I do not have machine experience, but I think vacuum too early would be a more likely cause of chips leaping to a nozzle. Juki nozzles are made of hardened stainless and could be slightly magnetic, but the end is relatively small and would not have t
Used SMT Equipment | SMT Equipment
1 Component size: 0603 chip - X W24mm L24mm Mount beat: 0.42s/QFP Placement accuracy: + - 30 um/ QFP Component size: 0603 chip - X W90mm L100mm if need more info about the products , pls don’t hesitate to contact with us at any t
Used SMT Equipment | SMT Equipment
Product name: new YAMAHA New product number: YAMAHA chip mounter Products in detail Features: Implement turret head support 1 head pasted on a variety of components. Fully realize fast, general motors, and high availability Interregional effic
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-04-15 08:39:15.0
Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)
Parts & Supplies | Pick and Place/Feeders
YAMAHA 8*4 FEEDER Feature : I-Pulse Tenryu Surface Mount systems Component Feeder. Part Name: I-pulse Pneumatic Feeder. Part Number: LG4-M1A00-000 F1-84-000321A Rating: 8x4mm Specifications: For I-Pulse Tenryu M8 M7 M6 M6ex M4e M4s M3
Parts & Supplies | Pick and Place/Feeders
YAMAHA 8*4 FEEDER Feature : I-Pulse Tenryu Surface Mount systems Component Feeder. Part Name: I-pulse Pneumatic Feeder. Part Number: LG4-M1A00-000 F1-84-000321A Rating: 8x4mm Specifications: For I-Pulse Tenryu M8 M7 M6 M6ex M4e M4s M3
Technical Library | 2021-09-15 18:53:20.0
Many printed circuit board assemblies (PCBAs) have relays that are soldered to the PCB. If such an electromechanical component fails, it can cause the whole device to fail, just like any other electronic component. The spectrum of root causes that lead to an increased contact resistance or a complete contact failure is totally different from what usually occurs in the electronics domain. This article provides a detailed analysis of these failures and the corresponding root causes, many of them self-centering.
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | | | IPC-A-610 Trainer (CIT) Recert.
The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.
Events Calendar | Thu Jul 22 00:00:00 EDT 2021 - Thu Jul 22 00:00:00 EDT 2021 | ,
Webinar: Effective Strategies to Sharpen Your Focus and Concentration
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Leadership and Communication Training Series
Career Center | All over the world, Alabama USA | Engineering
2023 is the year for I.C.T's global localization strategy, and we are seeking talented individuals worldwide for the following positions. I.C.T adheres to the principles of "Simple, Open, Undertake, Coordination and Share" to build a pl
Career Center | Rolling Meadows, USA | Quality Control
Technical Trainer Professional solder training company is seeking individual to teach solder skills-based training as well as other electronics assembly courses. Individual should be able to communicate effectively with others. Training or teaching
Career Center | San Diego, Michigan USA | Sales/Marketing
* Results driven Sales Executive combining expertise in Building Sales networks and strategic business development in the Electronic Component, Connector, and Electronic Manufacturing Equipment industries * Extensive Field Sales experience with a tra
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
Application Of Build-in Self Test In Functional Test Of DSL SMTnet Express May 23, 2012, Subscribers: 25234, Members: Companies: 8880, Users: 33129 Application Of Build-in Self Test In Functional Test Of DSL First published in the 2012 IPC APEX
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_convex-resistor-chip-array_topic2437.xml
PCB Libraries Forum : Convex Resistor Chip Array PCB Libraries Forum : Convex Resistor Chip Array This is an XML content feed of
GPD Global | https://www.gpd-global.com/dispense-flip-chip-bga.php
Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
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