Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Used SMT Equipment | SMT Equipment
1 Component size: 0603 chip - X W24mm L24mm Mount beat: 0.42s/QFP Placement accuracy: + - 30 um/ QFP Component size: 0603 chip - X W90mm L100mm if need more info about the products , pls don’t hesitate to contact with us at any t
Used SMT Equipment | SMT Equipment
Product name: new YAMAHA New product number: YAMAHA chip mounter Products in detail Features: Implement turret head support 1 head pasted on a variety of components. Fully realize fast, general motors, and high availability Interregional effic
Industry News | 2003-06-18 07:56:46.0
The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
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Parts & Supplies | Chipshooters / Chip Mounters
Original YAMAHA SMT Ss 8mm Feeder Khj-Mc100-009 Model NO.: KHJ-MC100-009 Type: High-speed Chip Mounter Quality: 100% Tested Part No: Khj-Mc100-009 Lead Time: 3 Days Trademark: YAMAHA Transport Package: Carton or as Your Requirements Specification:
Parts & Supplies | Chipshooters / Chip Mounters
YAMAHA SMT Original Ss 12-16mm Feeder Khj-Mc200-003 Model NO.: KHJ-MC200-003 Type: High-speed Chip Mounter Quality: 100% Tested Part No: Khj-Mc200-003 Lead Time: 3 Days Trademark: YAMAHA Transport Package: Carton or as Your Requirements Specificati
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Career Center | Woodbury, Minnesota USA | Management,Production
Over 20 yrs experience in SMT. Worked with medical, industrial, communications, aerospace and automotive electronics. Have experience working in ITAR controlled companies.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/Wafer-Option-PBFT-PBT-3000M.pdf
. The WPBFT accommodates 100 mm long wafer chip with widths of 10 mm, 15 mm, 20 mm, 25 mm, and 30 mm. Test results are recorded for incoming or outgoing taped components
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/chip-scale-package_topic1252.html
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