State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With
New Equipment | Cleaning Equipment
High Temperature, High Pressure Aqueous/Semi-Aqueous Batch Electronics Cleaning Systems Forget the limitations of the past and experience a batch system that offers multiple cleaning technologies for capability previously unachieved in a compact fo
Industry News | 2010-02-18 21:26:02.0
Minneapolis, MN - The SMTA is pleased to announce several new webinars coming up in March. Webinars are 60 to 90 minute online presentations comparable to a conference session. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.
Technical Library | 2007-03-28 10:18:33.0
Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging.
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Apr 20 18:30:00 UTC 2021 - Tue Apr 20 18:30:00 UTC 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
SMTnet Express, January 23, 2020, Subscribers: 33,753, Companies: 10,965, Users: 25,546 Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies Credits: ALTER TECHNOLOGY Flip chip assembly techniques bring a wide range
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/questions-answers_forum34&SO=A&OB=desc_page15.html
:23am Can I create chip components with one click? By m4l490n , 11 Jan 2022 at 11:07am 3 216 By Tom H 31 Jan 2022 at 10:29am Root Element is Missing By
