Industry Directory: chip stress (4)

Technology Seminars, Inc.

Industry Directory | Consultant / Service Provider

Serving the Educational Needs of Modern Technologies

Synova S.A.

Industry Directory | Manufacturer

Synova is an experienced manufacturer of innovative laser cutting systems for an extraordinary range of micro-machining and dicing applications.

New SMT Equipment: chip stress (65)

ETA SMT Desktop PCBA Router ETA-100A

ETA SMT Desktop PCBA Router ETA-100A

New Equipment | Depaneling

ETA SMT Desktop PCBA Router ETA-100A If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB cutting machine,PCB cutter,PCB separator,PCB depane

Dongguan Intercontinental Technology Co., Ltd.

PCB cutting machine/PCB depaneling machine/PCB separator ASC-700/led separator/pcb cutter

PCB cutting machine/PCB depaneling machine/PCB separator ASC-700/led separator/pcb cutter

New Equipment | Depaneling

PCB cutting machine/PCB depaneling machine/PCB separator ASC-700 model from ASCEN technology co.,ltd The more detail and video please check the link: www.pcb-separator.com           Any inquiry please sent the email to : info@pcbasc.com   This mac

ASCEN Technology

Electronics Forum: chip stress (86)

Cracked ceramic chip capacitors.

Electronics Forum | Fri Apr 18 16:53:25 EDT 2003 | takfire

DST, What was the crack signature? Was the crack parallel with the internal electrodes or 45� with the terminal electrode? It is also important to determine the orientation of the failed caps on the PCB (in regards to depaneling). Perhaps the cap

BGA chip corner epoxy / adhesive?

Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest

Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond

Used SMT Equipment: chip stress (3)

Panasonic CM212-M Chip Mounter

Panasonic CM212-M Chip Mounter

Used SMT Equipment | Pick and Place/Feeders

Panasonic placement machine cm212 features one:    Achieved a maximum of 54,000 CPH (0.067s/pcs)      Actual efficiency   38,000 CPH (0.098s/pcs)    Substrate transport time…3.6 s (~substrate X=215㎜)  

Qinyi Electronics Co.,Ltd

Hitachi HITACHI SIGMA-G5/175020S2042

Hitachi HITACHI SIGMA-G5/175020S2042

Used SMT Equipment | Pick and Place/Feeders

Concept: Over drive motion Ultimate access Super wide range DDH V5 Smart operation Voluntary line operation Wide open &Easy access Quick exchange Auto changeover PP type LISA Feeder hot swap Chip theory speed 84500chip Placement ra

Qinyi Electronics Co.,Ltd

Industry News: chip stress (65)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�

Industry News | 2009-04-15 23:12:38.0

BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: chip stress (11)

Juki JUKI NGA JIP PLATE A ASM

Juki JUKI NGA JIP PLATE A ASM

Parts & Supplies | Assembly Accessories

JUKI NGA JIP PLATE A ASM E21499980A0 We are Supply SMT Pick and Place Equipment spare parts(Smt nozzle, Smt Cylinder, Smt Valve, Smt Sensor, Smt Feeder, Smt CPU Board, Smt Laser, Smt driver, Smt ejector……)  for Yamaha, JUKI, FUJI ,Panasonic, Samsun

Ping You Industrial Co.,Limited

Juki JUKI E94867210A0 LQ MOTOR EXTE

Parts & Supplies | Pick and Place/Feeders

> www.fujintai.com JUKI E9621715000 CAMERA NO.11 LENS FUJINTAI TECHNOLOGY CO.,LTD JUKI E9621727000 Z/THETA CTL CABLE www.fujintai.com JUKI E9621729000 YC 1 SHAFT DRIVER FUJINTAI TECHNOLOGY CO.,LTD JUKI E9621739000 TWISTED PAIRED CABLE (5M) ww

FUJINTAI TECHNOLOGY CO.,LIMITED

Technical Library: chip stress (9)

Improvement of Organic Packaging Thermal Cycle Performance Measurement

Technical Library | 2006-11-01 22:37:23.0

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation.

IBM Corporation

Ultra-Thin Chips For High-Performance Flexible Electronics

Technical Library | 2020-01-15 23:54:34.0

Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.

Bendable Electronics and Sensing Technologies (BEST)

Videos: chip stress (10)

I.C.T Off Line LED Flex Pick and Place Machine M Series

I.C.T Off Line LED Flex Pick and Place Machine M Series

Videos

  New Upgrade — I.C.T SMT LED Flexible Pick and Place Machine M series   In 2022, we have upgraded the equipment of the M series pick and place machine for SMT Production line. I.C.T M series pick and place machine is mainly used for the producti

Dongguan Intercontinental Technology Co., Ltd.

Desktop PCBA Router

Desktop PCBA Router

Videos

ETA SMT Desktop PCBA Router ETA-100A If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB cutting machine,PCB cutter,PCB separator,PCB depane

Dongguan Intercontinental Technology Co., Ltd.

Career Center - Resumes: chip stress (4)

resume

Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing

• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.

Operations Manager

Career Center | Stouffville, Ontario Canada | Management

95% on time delivery. Measures daily manufacturing performance versus plan, and work with manufacturing and engineering to determine and communicate corrective actions to maintain on-plan performance. Develops and maintains inventory management sys

Express Newsletter: chip stress (407)

Modelling of Thermal Stresses in Printed Circuit Boards

Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal

Partner Websites: chip stress (69)

1008 Chip Inductor Land Pattern - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2858&OB=DESC.html

1008 Chip Inductor Land Pattern - PCB Libraries Forum   Forum Home > Libraries > Footprints / Land Patterns    New Posts    FAQ    Search    Events    Register    Login 1008 Chip Inductor Land Pattern

PCB Libraries, Inc.

Electronics IC Package Design

Whizz Systems | https://www.whizzsystems.com/ic-package-design/

. Last production stage of semiconductor devices is packaging of semiconductor. IC packaging makes semiconductor to stay protected from possible stress and make electrical connection from semiconductor chip to PCB

Whizz Systems


chip stress searches for Companies, Equipment, Machines, Suppliers & Information

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Blackfox IPC Training & Certification

Easily dispense fine pitch components with ±25µm positioning accuracy.
SMT feeders

Component Placement 101 Training Course
convection smt reflow ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers