Industry Directory | Consultant / Service Provider
Serving the Educational Needs of Modern Technologies
Industry Directory | Manufacturer
Synova is an experienced manufacturer of innovative laser cutting systems for an extraordinary range of micro-machining and dicing applications.
PCB cutting machine/PCB depaneling machine/PCB separator ASC-700 model from ASCEN technology co.,ltd The more detail and video please check the link: www.pcb-separator.com Any inquiry please sent the email to : info@pcbasc.com This mac
The more detail and video please check the link: www.pcb-separator.com This machine specializing the LED aluminum board. and very popular in Europe .It can cut the board with the led chip no damage and no bend. Our SMT automation equipment
Electronics Forum | Fri Apr 18 16:53:25 EDT 2003 | takfire
DST, What was the crack signature? Was the crack parallel with the internal electrodes or 45� with the terminal electrode? It is also important to determine the orientation of the failed caps on the PCB (in regards to depaneling). Perhaps the cap
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Used SMT Equipment | Pick and Place/Feeders
Panasonic placement machine cm212 features one: Achieved a maximum of 54,000 CPH (0.067s/pcs) Actual efficiency 38,000 CPH (0.098s/pcs) Substrate transport time…3.6 s (～substrate X=215㎜)
Used SMT Equipment | Pick and Place/Feeders
Concept: Over drive motion Ultimate access Super wide range DDH V5 Smart operation Voluntary line operation Wide open &Easy access Quick exchange Auto changeover PP type LISA Feeder hot swap Chip theory speed 84500chip Placement ra
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2009-04-15 23:12:38.0
BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.
Parts & Supplies | Assembly Accessories
JUKI NGA JIP PLATE A ASM E21499980A0 We are Supply SMT Pick and Place Equipment spare parts(Smt nozzle, Smt Cylinder, Smt Valve, Smt Sensor, Smt Feeder, Smt CPU Board, Smt Laser, Smt driver, Smt ejector……) for Yamaha, JUKI, FUJI ,Panasonic, Samsun
Parts & Supplies | Pick and Place/Feeders
> www.fujintai.com JUKI E9621715000 CAMERA NO.11 LENS FUJINTAI TECHNOLOGY CO.,LTD JUKI E9621727000 Z/THETA CTL CABLE www.fujintai.com JUKI E9621729000 YC 1 SHAFT DRIVER FUJINTAI TECHNOLOGY CO.,LTD JUKI E9621739000 TWISTED PAIRED CABLE (5M) ww
Technical Library | 2006-11-01 22:37:23.0
Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation.
Technical Library | 2020-01-15 23:54:34.0
Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.
New Upgrade — I.C.T SMT LED Flexible Pick and Place Machine M series In 2022, we have upgraded the equipment of the M series pick and place machine for SMT Production line. I.C.T M series pick and place machine is mainly used for the producti
ETA SMT Desktop PCBA Router ETA-100A If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB cutting machine,PCB cutter,PCB separator,PCB depane
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | Stouffville, Ontario Canada | Management
95% on time delivery. Measures daily manufacturing performance versus plan, and work with manufacturing and engineering to determine and communicate corrective actions to maintain on-plan performance. Develops and maintains inventory management sys
Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2858&OB=DESC.html
1008 Chip Inductor Land Pattern - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login 1008 Chip Inductor Land Pattern
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/imaps-device-packaging-2018
. In Flip Chip and Chip on Board packages, coating and encapsulation materials are applied on the die and the components to protect them from physical stress, contamination, invasion, electrical bridging, etc
