Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions
F.I. Group s.r.o. is established to support businesses using SMT machines and technology. Our main business field is SMT technology, buy/sell of used machines, supplying materials, spare parts for SMT production
Features of Refurbished JUKI JX-350 High Efficiency SMT Placement Machine Chip: 32,000CPH chip (Laser centering/Optimum); 21,000CPH chip (Laser centering / IPC9850). ■ From 0603 to 33.5mmsquare components. ■ JUKI laser centering for high speed,
JUKI JX-300 LED SMT Chip Mounter Machine Improvements in Productivity Outstanding Area Productivity Mounting Quality that Supports High Density Mounting Model Interchangeability Model FX-3 FX-1R(Conventional model kind) P
Used SMT Equipment | Chipshooters / Chip Mounters
Juki FX-1R Pick & Place Machine, Chip Shooter: high Speed Modular Mounter FX, 33,000 CPH, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Used SMT Equipment | Chipshooters / Chip Mounters
Quad IVC Pick and Place Location: San Antonio, TX S/N:2383
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-06-20 08:31:58.0
Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
Training Courses | | | IPC-7711/IPC-7721 Expert (CSE)
The IPC-7711/IPC-7721 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-7711/IPC-7721 standard.
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue May 03 18:30:00 UTC 2022 - Tue May 03 18:30:00 UTC 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Events Calendar | Wed Mar 24 18:30:00 UTC 2021 - Wed Mar 24 18:30:00 UTC 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | San Jose, California USA | Sales/Marketing
Sales Manager PCB Manufacturing Equipment: This candidate will be responsible for selling a complete line of Japanese PCB (Printed Circuit Board) manufacturing equipment, including chip shooters, chip placers, etc. The sales territory is the entire
Career Center | Boise, Idaho USA | Engineering,Research and Development
Sr. Microelectronics Development Engineer Over 20 years experience in SMT Process Development for large Contract Manufacturer. Specialist in Stencil Printing, Component Placement, Dispense, Reflow, Rework, RoHS Processes, Material and Equipment Quali
Career Center | Binan, laguna, Philippines | Maintenance
WORK EXPERIENCE: Date : November 3, 2006 to present Company : First Sumiden Circuit Incorporated Address : Light Industries Science Park Cabuyao Laguna Principal Product : Electronics Manufacturing / FP
SMTnet Express, February 27, 2014, Subscribers: 22818, Members: Companies: 13775, Users: 35799 A Novel High Thermal Conductive Underfill For Flip Chip Appliation. Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Silicon dioxide
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/40046972-stopper-chip-215934?page=219&order=list_price+asc
..40046972 /shop/40046972-stopper-chip-215934 ¥ 0.00 0.0 CNY ¥ 0.00 ¥ 0.00 This combination does not exist. ADD TO CART Inquiry Now
KingFei SMT Tech | http://www.smtspare-parts.com/sale-9401138-panasonic-hdp-chip-glue-dispensing-nozzle-2d2s-chip-nozzle-for-1608mm-component.html
Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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