Industry Directory | Manufacturer
A worldwide leader in Automated Optical andx-ray Inspection systems
Industry Directory | Consultant / Service Provider
As a leader in electronic design automation (EDA) and semiconductor intellectual property (IP), Synopsys delivers products and services that accelerate innovation in the global electronics market.
Hanwha Decan S2 SMT Assembly line Decan S2 SMT Assembly Line Decan S2 SMT Assembly Line SMT PCB production Full Automatic Assembly line Speed:158000CPH Product description: Hanwha Decan S2 SMT Assembly line, Speed 158000CPH INQUIRY Ha
Automatically verifies the correctness of the feeder set-up durning PCB assembly. Suitable for Fuji, Sanyo, Panasonic and Universal chip-shooters.
Electronics Forum | Fri Sep 15 09:14:55 EDT 2017 | dleeper
From my perspective, I like marked parts because I can use AOI to verify the correct parts are being placed in production. If an operator is going to load the wrong reel, I prefer to find out on the first PCB rather than after 5000 wrong parts have b
Electronics Forum | Fri Sep 07 08:47:45 EDT 2001 | Hussman
Board support will almost always cause the part to be miss-mounted. The bouncing affect of the board can cause the part to bouce off the board. BUT, you never stated where the ends up or anything like that. Is the part on the board but just floppi
Used SMT Equipment | Pick and Place/Feeders
Reliability Powerful Camera algorithm is used Improved recognition accuracy by image noise cancellation of components and automatic teaching function Real-time automatic compensation of Chip, TR, BGA, QFP and other component pick-up positions Easy
Used SMT Equipment | Chipshooters / Chip Mounters
(4) Universal GC60 Chipshooters With Lighting Heads Available Auction Items: August 15th Auction www.xlineassets.com Universal Genesis GC60 Pick and Place System, Model 4990C, Year 2006, (2) Lighting Revolver Placement Heads, Recently Serviced
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2016-04-20 18:15:34.0
Nordson ASYMTEK will present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results at the SMT Hybrid Packaging Show in Nuremberg, Germany, in the smartTec stand 7-109 from 26-28 April 2016. Nordson ASYMTEK's award-winning Quantum® Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show's Future Packaging Line at stand 6-434.
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Parts & Supplies | SMT Equipment
E86547150B0 BUMEN PWB B ASM E86557000A0 CGU BOARD E86557150A0 CHIP STANDING DETECTION PCB AS E8655715AA0 CHIP STANDING DETECTION PCB AS E86557210A0 HIGHT SENSOR BOARD ASM. E86567000A0 SRAM CIRCUIT BOARD ASM. E8657700000 CPU B
Parts & Supplies | Pick and Place/Feeders
Repair JUKI FX-1R X drive MR-J2S-200B-S009V613 JUKI FX-1R X SERVO DRV ASM PN: 40026792 Model:MR-J2S-200B-S009V613 40026514 DETECTOR BR 40026591 SILICON DISK ASM XP(CH) 40026593 IO CYLINDER BRACKET 40026594 FB SENSOR MOUNTING BRK 40026595 IO C
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
E86547150B0 BUMEN PWB B ASM E86557000A0 CGU BOARD E86557150A0 CHIP STANDING DETECTION PCB AS E8655715AA0 CHIP STANDING DETECTION PCB AS E86557210A0 HIGHT SENSOR BOARD ASM. E86567000A0 SRAM CIRCUIT BOARD ASM. E8657700000 CPU B
Samsung/ Hanwha DECAN F2 Advanced Chip Shooter If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and pla
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
Career Center | EDEN PRAIRIE, Minnesota USA | Production
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
Career Center | kemaman, malaysia Philippines | Maintenance,Production,Technical Support
• Conduct repairs and troubleshooting of production equipment to avoid / minimize production downtime. • Performs preventive maintenance of production equipment as defined in work procedure and according to their schedule of frequency. • C
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=7
: Lighting and LED Gen7 Nordson SONOSCAN FLIP CHIP Nordson SONOSCAN Flip Chip disbonded solder bumps and halo defects - Application Note 354 Publications Nordson SONOSCAN Click on the links below to
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_altium-0402-resistor-footprint_topic2596.xml
;Every chip package size requires a different solder joint goal and even IPC-7351 does not support that theory. But it's true. There are documents on your computer in this folder
