Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
New Equipment | Design Services
FPGA Design Service, FPGA Development Service, FPGA Prototyping Service Extensive experience with FPGA Design, Development & Prototyping. We are the preferred manufacturer and design partner for Xilinx, Altera, Lattice & Tabula. Our work ranges
YAMAHA Refurbished YG100 Chip Mounter SMT Pick and Place Machine YAMAHA YG100 high-speed placement chip, high-precision, high-speed modular placement machine,high rigidity dual drive structure,High-performance servo system, high-resolution digital m
Electronics Forum | Fri May 12 09:24:45 EDT 2000 | Ashok Dhawan
I need to install two SMD chips (0805) at one location. I refered to IPC-HDBK-001, fIG 6-24. When I solder the chips side by side, the ceramic side which is placed againgst solder pad- is already touching the solder. While I complete the solder joint
Electronics Forum | Wed Feb 05 20:56:23 EST 2003 | jonfox
I think you just answered a questioned that I never thought to ask. Are bulk parts manufactured differently than standard tape and reel parts? That would explain why there is a bigger price difference in parts from Murata and not from others. As I
Used SMT Equipment | Chipshooters / Chip Mounters
Juki FX-1R Pick & Place Machine, Chip Shooter: high Speed Modular Mounter FX, 33,000 CPH, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Used SMT Equipment | Chipshooters / Chip Mounters
Quad IVC Pick and Place Location: San Antonio, TX S/N:2383
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2021-04-19 03:58:42.0
Whizz Systems, Inc., the award-winning premier provider of electronics product design, development, and manufacturing services located in the heart of the Silicon Valley, today announced the appointment of Humza Babar as its new Marketing Associate.
Parts & Supplies | Chipshooters / Chip Mounters
SMT JUKI FF12MM CHIP MOUNTER FEEDER More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Parts & Supplies | Chipshooters / Chip Mounters
SMT JUKI FF12MM CHIP MOUNTER FEEDER More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
BTW, we have sepcialzied in SMT field over 12 years and support one-stop SMT solution for our customers. Including SMT equipment and spare parts, such as Loader and Unloader, Reflow oven, Nozzle, feeder, motor, PCB board ect. We can also customize
Description MODEL ID: CM402-L MODEL NUMBER: KXF-4Z4C PCB DIMENSIONS: L 50 mm x W 50mm to L 510 mm Ã? W 460 mm HEAD TYPE: Type A-2 (12/12 nozzles HIGH-SPEED) (OPTION) Number of nozzles: 12 nozzles/head Maximum speed: 0.052 s/chip (69,500
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | , New Jersey USA | Engineering
Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | Cebu, Philippines | Engineering,Maintenance,Technical Support
Experience SMT machine maintenance and SMT process from raw materials to finish goods
SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_2-pad-chips-with-different-lead-length_topic1988.xml
PCB Libraries Forum : 2 Pad Chips With Different Lead Length PCB Libraries Forum : 2 Pad Chips With Different Lead Length This is an XML content feed of
