Electronics Forum | Mon Jan 07 21:07:00 EST 2002 | davef
Using a flux pen sounds like a good idea. Comments are: * I assume you�re talking aqueous flux. If not, some NC flux pens leave white residues. Nearly all of 15 samples suffered to varying degrees with white residues. * Use the same flux that you
Electronics Forum | Sun Jul 29 21:23:27 EDT 2001 | nifhail
When carry out the contamination test,do we measure for Chlorides on water soluble and No-clean fluxes? 1) What is the equivalent factor for machines developed to test the board cleanliness, Omega-meter vs Ionograph vs Zero-ion. 2) What values do we
Industry News | 2018-09-23 09:57:15.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Industry News | 2008-12-09 09:03:44.0
By customer demand, ACL Incorporated's long-lasting static dissipative coating called Staticide ESD Safety Shield is now available as an aerosol spray.
Parts & Supplies | ESD Control Supplies
ES28101 Antistatic pink finger cot The main material is latex and the static electricity protection compounds and the antioxidant are added，which could effectively protect the microcircuit and the precision electronic instruments in such a circumsta
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
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