Industry Directory | Consultant / Service Provider
INLYNK Software is a Software Solution provider for the electronics manufacturing industry. FEATURES: - Parts & BOM Management - Suppliers Management - Customers Management - Production Management
Industry Directory | Distributor / Manufacturer
Lorlin manufactures discrete semiconductor component test systems for small signal and power devices. 50 years in business, over 3000 installations. SMD devices: transistors, Fets, diodes, scrs, triacs, optos, and many others.
If you have only Gerber data files to work with then ProntoGERBER-CONNECTION can help you! ProntoGERBER-CONNECTION imports raw Gerber data and allows the user to add intelligent information to the shapes on the display and create process assembly
ProntoAOI is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as YESTech, Mirtec, Orbotech, Agilent, Omron, CyberOptics, Vi
Electronics Forum | Thu Aug 10 11:55:18 EDT 2017 | emeto
I am going to implement a part number system in our production. Still debating what is the better approach. Does anyone use intelligent part number system(where numbers integrates part package, value, tolerance, carrier, voltage requirements....)? I
Electronics Forum | Sun Dec 20 23:52:42 EST 2015 | vmam99
What part number for RAFE topmark package SOT-23? Like a Attachment picture.
Used SMT Equipment | SMT Equipment
Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2003-01-24 09:07:53.0
For Industrial, Telecom and Datacom Use
Industry News | 2003-05-19 09:16:12.0
Labtech will be exhibiting at the 2003 IEEE MTT-S Exhibition
Parts & Supplies | Component Packaging
JUKI KE-2020 Q-Motor(E9630729000) Part Number: E9630729000 (20W), Specifications: TS4632N2020E600
Parts & Supplies | Component Packaging
Plastic Samsung Fixed Take Up Reel For CP45 12mm Feeder Part Number J2500460 Detailed Product Description Part Name: Fixed Take Up Reel Part Number: J2500460 Material: Plastic Fuction: Feeder Part Band: Samsung Use: CP45 12mm Feeder
Technical Library | 2021-12-31 06:09:47.0
The packaging method of surface mount components has become an important part of the SMT system. It directly affects the efficiency of assembly production and must be optimized in combination with the type and number of feeders of the SMT machine. There are four main types of packaging for surface mount components, Tape, tube, tray and bulk.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
ProntoGERBER-CONNECTION software is used by electronic manufacturer & imports raw Gerber data & allows the user to add intelligent information to the shapes on the display and creates real reference designators, theta rotation, part numbers, X/Y comp
www.unisoft-cim.com/prontoaoi.htm - ProntoAOI software from Unisoft is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as
Events Calendar | Thu Apr 22 00:00:00 EDT 2021 - Thu Apr 22 00:00:00 EDT 2021 | ,
Atlanta Chapter: Tech-Day
Career Center | TULSA, Oklahoma USA | Engineering,Production,Purchasing,Research and Development
This opportunity is with a global industry leader designing and manufacturing sophisticated electronic assemblies and sub-assemblies. These products play a very significant role throughout the world providing essential equipment and components to the
Career Center | New York, New York USA | Production,Sales/Marketing
Production Manager: Textile Industry A small fast growing company, located on the south side of Chicago, is looking for a well-organized individual to: �h Direct and coordinate production, processing, and distribution activities. �h Coordinate and
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages Optimizing Reflowed Solder TIM (sTIMs
| https://unisoft-cim.com/overview_chart.php
( enable JavaScript for our phone number ). Online meeting demonstrations; trial software; or questions. Test the software today! A crucial test of whether the software will work for you is using your data files in your own environment
