Industry Directory | Manufacturer
SAFE-PCB Group is a global leading provider of time-critical and technologically complex PCBs, attractive for small and medium volume quick-turn orders. We provide 2-hour images for validation, same day production, and wide range.
Industry Directory | Manufacturer
Accu-sembly, Inc. is a subcontract electronic assembly house providing assembly services to many different manufacturers. In the past 25 years, we have worked with hundreds of customers from one man operations to industry-leading corporations.
New Equipment | Soldering - Other
PARENTNashik offers resistance spot welding Spares, consumables & accessories weldparts for portable welders, spot welding guns, projection & seam welder, machines. Spot welding electrodes, cap tips, bend electrodes, double bend electrodes, shanks,
New Equipment | Assembly Services
One-stop PCB Assembly Services Asia Pacific Circuits is capable of providing full turn-key and partial turn-key PCB assembly services. For full turn-key, we take care of the entire process, including manufacture of Printed Circuit Boa
Electronics Forum | Mon Apr 13 18:18:31 EDT 2020 | wbrenner
Does any one have a general cost percent going from class 2 to class 3 for the same Assembly.. Or, general up charge percent when biding class 2 vs class 3?
Electronics Forum | Tue Apr 14 08:58:45 EDT 2020 | emeto
Charge them double
Industry News | 2008-09-21 01:46:38.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Joe Russeau (Session Chair) of Precision Analytical Laboratory, Dr. Bev Christian of Research in Motion, Dave Hillman of Rockwell Collins, Matt Kehoe of Sipad Systems, and Doug Schueller of AbleConn will present during Session 3 on Building to Customer Reliability Standards in Class 2 and Class 3. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Industry News | 2023-04-17 08:38:56.0
IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Paramount Enterprises with a renowned brand PARENTNashik is an ISO 9001:2015 certified company, listed in major leading manufacturers, suppliers & exporters of resistance spot welding consumables, spares, weldparts in Nashik – India. PARENTNashik is
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Career Center | Nashville, North Carolina USA | Production
MUST BE WILLING TO BECOME FULLY VACCINATED FOR COVID-19, OR QUALIFY FOR A RECOGNIZED EXEMPTION, TO WORK AT ACDI IF GOVERNMENT CONTRACTOR REGULATIONS ARE UPHELD. OUR COMPANY What we do day-in and day-out has a lasting, meaningful impact across man
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support
A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te
SMTnet Express, July 28, 2016, Subscribers: 25,879, Companies: 14,883, Users: 40,795 Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware Mike Bixenman, DBA - Kyzen Corporation | Ryan Hulse, PHD - Honeywell
Imagineering, Inc. | https://www.pcbnet.com/blog/class-ii-vs-class-iii-inspection-standards-in-pcb-assembly/
Class 2 & Class 3 Inspection Standards in PCB Assembly | Imagineering Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/class-3-design-specs_topic331.html
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