Industry Directory | Manufacturer
Manufacture defluxers, cleaners & maintenance solutions used to remove solder paste, flux residues, SMT Adhesives and other soils during the manufacture of electronic components or during the assembly of printed circuit boards.
Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
New Equipment | Rework & Repair Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. Economical Br
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
Electronics Forum | Fri Apr 07 16:10:44 EDT 2000 | Chris McDonald
Kapton Tape should not leave a residue. But Ive seem cheap Kapton do that. Anyways I have gotten a stencil cleaner soldevent to clean off tape residue (Multicore has a good one) It will meet IPC. Chris
Electronics Forum | Fri Apr 07 11:52:44 EDT 2000 | Ashok Dhawan
Can anyone suggest a cleaning solvent for removing silicon residue after K Tape has gone through 2 cycles of reflow soldering ? The solvent or cleaning method has to be compliant to IPC Standards - to be used for cleaning gold edge fingers - PCB asse
Used SMT Equipment | Board Cleaners
Aqueous Tech Trident 111 Must sell posted 5/5/15 208V 3 phase 40 Amps Year 2008 Trident III is capable of removing all flux residues including rosin, no-clean and water soluble. Both lead and lead-free flux residues may be removed using the
Used SMT Equipment | Board Cleaners
Aqueous Technologies Trident III Cleaning System SKU 16561 : For pricing or questions please call or email us • Refurb 2024 • Environmentally Responsible Fully Automated Cleaning System • Optional Zero Discharge * &
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Industry News | 2003-04-01 08:40:24.0
Using environmentally safe solvents these machines offer two-stage, multiple-frequency ultrasonic cleaning, rinsing and drying for pcb defluxing, cleaning of precision parts and metal degreasing.
Technical Library | 2022-10-11 17:27:08.0
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature, high alloy surface tension, miniaturization, air soldering due to low cost consideration, and environmental concern. Accordingly, the flux features desired included high thermal stability, high resistance against burn-off, high oxidation resistance, high oxygen barrier capability, low surface tension, high fluxing capacity, slow wetting, low moisture pickup, high hot viscosity, and halogen-free. For each of the features listed above, corresponding desired chemical structures can be deduced, and the impact of those structures on flux residue cleanability can be speculated. Overall, lead-free flux technology results in a greater difficulty in cleaning. Cleaner with a better matching solvency for the residue as well as a higher cleaning temperature or agitation are needed. Alkaline and polar cleaner are often needed to deal with the larger quantity of fluxing products. Reactive cleaner is also desired to address the side reaction products such as crosslinked residue.
Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester
SMTnet Express, August 30, 2018, Subscribers: 31,289, Companies: 11,033, Users: 25,137 Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue Eric Bastow; Indium Corporation No-clean solder pastes are widely
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smartsonic_6000_stencil_cleaner.html
Smart Sonic 6000 Smart Sonic 6000 Stencil Cleaner See attached pictures and information below Smart Sonic Model Number: 6000 Serial Number: SSC-0602-1292 Year 2003 Cleans solder paste, adhesives and flux residue in one machine Maximum Stencil Size
| https://www.eptac.com/wp-content/uploads/2014/07/eptac_08_20_14.pdf
