Industry Directory: cleaning underside (1)

Shenzhen Huancheng Automation Equipment Co., Ltd

Industry Directory | Manufacturer

Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.

New SMT Equipment: cleaning underside (10)

DEK Under-Stencil Cleaning Fabric

DEK Under-Stencil Cleaning Fabric

New Equipment | Cleaning Equipment

DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative

ASM Assembly Systems (DEK)

NanoSlic Gold Stencil Coating

NanoSlic Gold Stencil Coating

New Equipment | Solder Paste Stencils

MET Stencil announces a new sprayed on baked on coating called NanoSlic Gold. We are currently offering a no charge sample to all of our new, and existing customers. Using advanced polymer chemistry, this coating has been developed to address the inc

MET Stencil

Electronics Forum: cleaning underside (37)

BGA underside cleaning

Electronics Forum | Thu May 07 08:31:13 EDT 1998 | Alan Pestell

We are about to use BGAs on our equipment. We clean all products prior to confomally coating them - to keep moisture off the IC legs. Will this be a problem with BGAs. Will we need to get the coating underneath the BGA or will the pitch on the balls

Re: BGA underside cleaning

Electronics Forum | Thu May 07 15:56:43 EDT 1998 | Terry Burnette

80ppm). The CTE of your board and solder joints will typically be 18-22ppm. We have seen cases were the coating fills the gap between the component and the board, then during temperature cycling the coating expands to the point of breaking the solder

Used SMT Equipment: cleaning underside (7)

DEK DEK 03iX

DEK DEK 03iX

Used SMT Equipment | Screen Printers

DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE

smtXtra

Speedprint SP1550 Long Board Printer

Speedprint SP1550 Long Board Printer

Used SMT Equipment | Screen Printers

Speedprint SP1550 Long Board Screen Printer Model: SP1550 Year: 2021 Accuracy: +/- 12.5µm @ 6 sigma Cycle Time: 16 seconds Stencil Size (Max): 1850mm x 736mm PCB Size (Max): 1550mm x 560mm Board Thickness: 0.4mm to 6mm Max Weight: 10kg Underside Cle

Midwest SMT

Industry News: cleaning underside (39)

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

MET Stencil Launches NanoSlic® Gold coated Stencil

Industry News | 2016-02-10 17:03:46.0

MET Stencil announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world's most advanced stencil coating technology for improving solder paste printing. "We are pleased to announce that we have been licensed by FCT Assembly to sell this coating to the US market.” said Fred Cox, President of MET Stencil. "Stencil users will immediately see the benefits in their print."

MET Stencil

Technical Library: cleaning underside (1)

Can Nano-Coatings Really Improve Stencil Performance?

Technical Library | 2017-10-26 01:18:49.0

Nano-coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include: Reduced underside cleaning, reduced bridging, improved solder paste release and improvements in yield. With several nano technologies already on the market and more likely to be introduced, how can the performance be quantified? How robust are these coatings? How can an assembler approach the ROI of these coatings? What hidden benefits or negative impacts should be considered? This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings.

FCT ASSEMBLY, INC.

Videos: cleaning underside (5)

VIGON® UC 160

VIGON® UC 160

Videos

Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer

ZESTRON Americas

Hydrophobic Surfaces

Hydrophobic Surfaces

Videos

NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste

Fine Line Stencil, Inc.

Express Newsletter: cleaning underside (728)

Partner Websites: cleaning underside (22)

A7A Automatic Airless Spray System | Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/industrial-coating-systems-products/a7a-automatic-airless-spray-guns

& Inspecting Treating & Curing Back Treating & Curing Cleaning Plasma Treating UV Curing Divisions Back Divisions Nordson Corporation is comprised of eight divisions, each representing its unique sector with various industry solutions

ASYMTEK Products | Nordson Electronics Solutions

Embedded IR Heater User Guide

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Embedded-IR-Heater-User-Guide-22140091.pdf

. Wear protective glasses and a protective suit for operation and cleaning to protect against any chemicals that may be sprayed out

GPD Global


cleaning underside searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next
2024 Eptac IPC Certification Training Schedule

High Precision Fluid Dispensers
PCB Handling Machine with CE

High Throughput Reflow Oven
SMT Machines

World's Best Reflow Oven Customizable for Unique Applications
SMT spare parts

Low-cost, self-paced, online training on electronics manufacturing fundamentals