New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
Now for nearly a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints with the patented ERSASCOPE technology. Industry experts including IPC recognize the critical importance of using ERSASCOPE technology
Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Used SMT Equipment | Conveyors
2016 Electro Design for Mycronic MB702 500mm Conveyor Details: Conveyor Length: 500mm Edge Belt SMEMA Interface Auto Width Adjustment Board Length: 2.8" - 18.5" Board Width: 2.0" - 20.0" Board Thickness: 0.016" - 0
The ERSASCOPE systems provide unique, optical inspection of solder joints. The patented systems ideally complement x-ray inspection of BGAs! Find our products ? https://www.kurtzersa.com/electronics-production-equipment/rework-inspection-systems/insp
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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/overlay-clearance-to-include-solder-mask_topic2267.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 4905 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Topic: Overlay clearance to include solder mask
