Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Wed Apr 23 11:28:11 EDT 2008 | jdengler
Did you ask Mirtec? When we were ready to buy a Mirtec they asked if we needed more than normal clearance height. I do not know if this would be retrofitable but maybe you could ask. Jerry
Electronics Forum | Fri Jan 07 16:30:53 EST 2022 | tey422
I have a quick question, what's the tallest (highest) SMT part you ever encounter? 1.5 inch or more? I have to set a depanel router's clearance height. It would need to recalibrate again every time if the spindle or camera's height is adjusted. There
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | Conveyors
onveyor Technologies MFIFO .6m -21 -4048 Date of Manufacture: 2018 Details: Vertical FIFO/LIFO/Pass throughEach Buffer Position Consists of a Moving Belt Surface to Provide Smooth transition In and Out of the Buffer21 Vertical Buffering SlotsAd
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2008-04-08 22:16:26.0
BURNSVILLE, MN � April 2, 2008 � R&D Technical Services Inc., the leader in the vapor phase equipment market, announces that its RD52 Inline Vapor Phase Reflow Oven was named as a first finalist in the Soldering Equipment category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008.
Parts & Supplies | Pick and Place/Feeders
SMT mounter accessories JUKI Yamaha Fuji Panasonic Siemens Samsung Sony Future feeder calibrator Feeder calibration instrument: 1、The whole machine has streamlined structure, easy operation and optimized function. And the use of high precision 0
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: LNC60 I/F Cable ASM Part Number: 40070445 Machine: JUKI KE2070 2080 FX3 Machine Condition: Original New Brand: JUKI Application: For LNC60 Laser 40070445 LNC60 I/F Cable ASM(2012) For JUKI 2070 2080 FX3 Mac
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
High Quality Selective Wave Soldering Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. wave soldering, wave soldering machine, D
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_reflow_ovens_btu_paragon98.html
) nominal clearance above belt Heated length: 98 inches ( 249.0 cm ) Belt height above floor: 33.0 to 39.0 inches to top of belt ( 83.8 to 99.0 cm ) Oven atmosphere: N2/Air Process Chamber System provides side to side recirculation convection
GPD Global | https://www.gpd-global.com/co_website/conformal-simplecoat-specs.php
(18" x 17" x 2.0") Bottom Side Clearance 100 mm (4") Conveyor Conveyor Type Pin Chain Conveyor Width (minimum 50 mm (2") Conveyor Width (maximum) 430 mm (17") Edge Clearance 6 mm
