Industry Directory | Manufacturer
used SMT & Ai customs clearance to china
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
Electronics Forum | Mon May 03 21:39:09 EDT 2004 | ACE
Does anyone know there a standard matrix of clearances part to part for Class 2 and Class 3 board design. IPC does issue a preferred matrix but they are so liberal they not so useful in the real world. Any suggestions would really be appreciated.
Electronics Forum | Wed May 05 09:23:11 EDT 2004 | InterConn
Hi ACE, I design with a Minimum of 0.40mm Body to Body on 0805 Chip size down for hi volumne products, 0.60mm would be preferred. Regards I/C
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •
Industry News | 2021-09-02 06:12:22.0
Count On Tools, Inc. (COT) is pleased to announce that the PB Swiss Tools Labor Day Sale starts Friday, Sept. 3, 2021. Enter promo code LABORDAY to receive 15 percent off through Monday, Sept. 6, 2021. This discount can even be applied to already discounted clearance and overstock items.
Industry News | 2018-04-15 20:01:15.0
SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Parts & Supplies | Screen Printers
1014794 MPM camera data line P9843 FILTER, VACUUM, 1.0 F NPT P10886 FILTER, SOLVENT, 74 UM SS, DISPOSABLE, .250 BARB QTY2 1016503 MOTOR, SOLVENT PUMP, DUAL HEAD, 200/300 ML/MIN 1016013-04 &n
Parts & Supplies | Pick and Place/Feeders
JUKI2040 40008065 X AXIS PLASTIC RAIL ASM Other juki parts: 40008062 X AXIS PLASTIC RAIL ASM(20) 40008063 X AXIS PLASTIC RAIL CHAINS(20) 40008065 X AXIS PLASTIC RAIL ASM 40008066 X AXIS PLASTIC RAIL CHA 40008068 X AXIS PLASTIC RAIL ASM 4000806
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Technical Library | 2011-07-28 18:52:34.0
Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel (clearance to the next card above the components) and large protrusions (components, e.g., BGAs, PQF
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Make: Universal Instruments Model: Genesis GX-11 Vintage: 2014 Details: Software Version 6.08 Head Assembly: Inline 4 Genesis 1M/P PEC Camera Removable Feeder Bank Assembly Magellen 2.3MPP Camera NPI Mode Left to Right Board Transport 3MM Cleara
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | , USA | Engineering,Management
Have you managed 1000 plus engineers? Do you enjoy directing the engineering for a giant DoD contractor? Then you need to talk to me about this job...Today. John Myers Executive Search in Electronic Manufacturing since 1991
Career Center | Lancaster, Pennsylvania USA | Engineering
Provide leadership to the engineering staff and manage, initiation and completion of all engineering deliverables. Deal with customers, business associates, program managers, manufacturing, planning, marketing and purchasing. Requires extensive kno
Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Purchasing,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/gear-pumps/reactor-discharge-pump-type-rp
temperature sensors integrated in the pump housing provides enhanced process diagnostic capabilities Optimized operating clearances to process polymers with a low viscosity Features: Type: RP-LE Application
| https://www.eptac.com/ask/soldering-minimum-space-requirements/
and their proximity or closeness will not impact or reduce minimum electrical clearances. Have a technical question? Dealing with a process or standards issue and not sure where to turn
