Industry Directory | Distributor / Manufacturer
Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.
Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Hanwha HM520 MF Pick and Place Machine The Hanwha HM520 MF series mos are a state-of-the-art high-speed modular with extreme flexibility. · Actual productivity is highest among machines of the same class · Optimized to high quality production · Unma
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Used SMT Equipment | AOI / Automated Optical Inspection
Mirtec AOI MV-7XI FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D DIGITAL MULTI-FREQUENCY
Used SMT Equipment | Pick and Place/Feeders
Mirtec AOI MV-7omni Description In-Line AOI Machine FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2003-03-06 08:43:16.0
Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.
Parts & Supplies | Assembly Accessories
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
ENERGY1 - TECHNICAL CONSULTANT FOR POWER , UTILITIES AND MANUFACTURING
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Career Center | jakarta, Indonesia | Engineering,Quality Control
; Reports internally to Project Managers and assists the Project Manager in meetings at the client�s engineering and stakeholders� level. ; Manages the Pre-Construction review meetings with contractor. Provides required advice on design issues arisin
Career Center | Shenzhen, China | Engineering,Production
Job requirements & responsibilities: 1. High school education or above 2. Above 5 years of relevant work experience in the PCB assembly industry 3. Familiar with electronic component testing, component identification and judgment and working
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Career Center | Sullivan, Ohio USA | Engineering,Maintenance,Production,Quality Control,Technical Support
· Develop or upgrade preventative maintenance procedures for components, equipment, parts, or systems. · Quoting of jobs to be competitive with other companies. · Problem solving and communication with operators for quality assurance. Pro
SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia
| https://www.smtfactory.com/news/Semi-auto-SMT-Production-Line.html
Semi-auto SMT Production Line news - Dongguan ICT Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語 Italiano Deutsch Português Español Pусский Français Home About Us Company Profile
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/meet-with-the-nordson-yestech-team-smtai-for-a-demonstration-on-the-fx-940-ultra-3d-aoi
. The YESTECH team will demonstrate the FX-940 ULTRA 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips
