Quality stencils for coarse and fine pitch solder and epoxy deposition. Cost and quality competitive against laser cut stencils. Twenty-four turn, no premium!
Substrate To Mask, Mask to Mask, Substrate To Substrate Interchangeable Vacuum Mask Holders Up to 17" Interchangeable Vacuum Chucks For Substrates Up To 16" Square, .3" Thick. Fixed Level And Planarizing Configurations, Fixed Or Removable Substrate
Electronics Forum | Thu Mar 28 16:11:12 EDT 2024 | kingkelvin
In calibration menu - I see coarse measurement of z unit offset, z-unit offset, measure hydra camera z level, coarse adjust hydra tool offsets, and measure hydra tool lengths 1 - 8 - would it be any of these that I should run?
Electronics Forum | Thu Jun 16 22:33:54 EDT 2005 | davef
Peter: Please explain: * You say, "The cooling phase is important to perform the strength of the solder joint." [We agree that fast cooling rates produce fine grain in solder and that fine grained solder connections are stronger than coarse grained.
Used SMT Equipment | In-Circuit Testers
Agilent 6284A Power Supply; 20V, 3A, 60W The Agilent-Hp 6284A Power Supply has separate coarse and fine voltage and current controls that allow the voltage and current outputs to be varied from zero to the maximum rated values very easily a
Used SMT Equipment | In-Circuit Testers
Agilent 6284A Power Supply; 20V, 3A, 60W The Agilent-Hp 6284A Power Supply has separate coarse and fine voltage and current controls that allow the voltage and current outputs to be varied from zero to the maximum rated values very easily and a
Industry News | 2010-05-20 12:47:37.0
GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.
Industry News | 2010-09-28 22:38:14.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, announces the release of MYDATA Replacement ZFF 250 Pre-Filters (OEM Part Number K-011-0051) for the full range of MYDATA SMT pick-and-place systems. The replacement pre-filters provide savings up to 30 percent over original MYDATA pre-filters, making production more affordable.
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Parts & Supplies | Pick and Place/Feeders
SM320 nozzle rod with internal teeth SAMSUNG HOLDER CP45 FV with elastic nozzle rod HOLDER CP45 NEO pole NOZZLE HOLDER CP45 NEO non-elastic nozzle rod HOLDER CP45 nozzle rod HOLDER CP2040 nozzle rod HOLDER SM120 non-elastic fine-tooth nozzle
Technical Library | 2022-01-05 23:10:11.0
Waste electrical and electronic equipment or e-waste generation has been skyrocketing over the last decades. This poses waste management and value recovery challenges, especially in developing countries. Printed circuit boards (PCBs) are mainly employed in value recovery operations. Despite the high energy costs of generating crushed and milled particles of the order of several microns, those are employed in conventional hydrometallurgical techniques. Coarse PCB pieces (of order a few centimetres) based value recovery operations are not reported at the industrial scale as the complexities of the internal structure of PCBs limit efficient metal and non-metal separation.
Technical Library | 2007-06-27 15:43:06.0
Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.
PCB Depaneling Router ML-CS818 This device is suitable for various small multi-connected PCB sub-boards such as mobile phones, tablet computers, automotive electronics, GPS, boards, etc. The enlarged size is suitable for the sub-board processing of
PCB DEPANELING MACHINE ML-CS817/ML-CS818/ML-CS818A/ML-CS818L PCB Depaneling Router ML-CS818 This device is suitable for various small multi-connected PCB sub-boards such as mobile phones, tablet computers, automotive electronics, GPS, boards, etc
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2018-09-24
.” Depending on customer requirements, Nordson supplies the screen packs with different layer combinations. One common structure, for example, has four layers, including two coarse square-weave layers that serve as the outer components and a finer internal square-weave layer
| http://etasmt.com/cc?ID=te_news_bulletin,23576&url=_print
(non-shiny) solder joints are usually the effect of coarse grain structure in the solid solder joint (though there can be other causes
