Industry Directory | Manufacturer
PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.
Industry Directory | Manufacturer
For more than three decades,Milplex Circuits Inc.has proven to be one of the leading manufacturers of PCB in the USA.the best service provided to our customers from our Addison office,1772 W Armitage Ct,Addison IL 60101 6302501580
Ersa HOTFLOW 4/14 Reflow Oven Working width: 45-560 mmProcess length: 4,400 mmHeated length: 2,665 mmCooling length: 1,735 mmWeight appr. 2,000 kgdimension: 5,030x1,410x1,350 mm Ersa HOTFLOW 4/14 Reflow Oven Ersa HOTFLOW 4/14 Reflow Oven Refl
Ersa HOTFLOW 3/20e SMT Reflow Oven Working width: 45-516 mm Process length: 4,840 mm Heated length: 3,725 mm Cooling length: 1,115 mm Weight appr. 1,900 kg Dimension: 6,265x1,201x1,375 mm Ersa HOTFLOW 3/20e SMT Reflow Oven Ersa HOTFLOW 3/20e S
Electronics Forum | Fri Jun 07 14:14:24 EDT 2019 | teejsd
Yes neither our HPLC IC nor our C3 could detect any concerning levels of ionics. Soaking over a weekend sounds like a good idea, though I may still need to cut the board down to fit our Kapak bag size. And get our silicone coating off the surface. K
Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol
Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask
Used SMT Equipment | Coating and Encapsulation
NEW LISTING: PVA Sigma Benchtop Conformal Coating Machine * Facilities Power 120V-220V +/-10%, 50-60 Hz Air 80 psi, dry unlubricated Exhaust 300 cfm * Specifications X-Axis Stroke 330 mm (13.00”) Y-Axis Stroke 300 mm (11.81”) Z-Axis Stroke 100 mm
Used SMT Equipment | Adhesive Dispensers
TH-2004C using for products dispensing processing requirements for higher precision, faster, good quality,better stability, complex path to developed design. This machine adopts PC computer-controlled, equipped with CCD visual images and import of se
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2018-02-12 12:28:00.0
GPD Global introduces its NEW full-featured benchtop dispensing robot system: Catalina. A benchtop system does not mean "no features". This compact and efficient semi-auto dispense robot provides you with numerous standard features: automatic vision, laser surface sensing, and automatic nozzle alignment and calibration.
Technical Library | 2016-03-03 17:25:26.0
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias.
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA
Quality Adhesive Technologies from LOCTITE - Free Workshop
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Glendale Heights, Illinois USA | Engineering,Production
Surya Electronics inc seeks a professional, innovative and detailed individual for our Process Engineer position. If you are looking for an opportunity to work in a fast-paced, manufacturing facility, then this challenging position is for you! Respo
Career Center | San Diego, California USA | Sales/Marketing,Technical Support
Do you want to put your dent in the universe? Are you are tired of being part of a slow moving bureaucratic coatings organization that sells old technology, can’t get things done and seems to create processes to hinder the selling process? Are y
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
Blackfox Training Institute, LLC | https://www.blackfox.com/wp-content/uploads/2017/04/BlackFox_Sharon.pdf
. It ad- dresses final finish and surface plating coating requirements, conductors, holes/vias, frequen- cy of acceptance testing and quality confor- mance as well as electrical, mechanical and en
