New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Electronics Forum | Fri Aug 10 15:30:38 EDT 2001 | davef
More and more pople are seeing voids in solder connections other than BGA balls than ever before. Thats because they never looked [never had the means to look] before. Now, they can't stand it and, like that zit that their mother told them not to m
Electronics Forum | Fri Aug 10 13:09:49 EDT 2001 | Hussman
Hey Wister, Assuming you are talking about BGA voids, and you just want to try and optimize your profile, you could try a "straight ramp profie". This is where the soak temp is constantly being elivated until you hit reflow. I find this helped me
Industry News | 2009-02-03 13:34:04.0
New PCB Rework, Repair, Fabrication Training & Consulting Services.
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
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SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
: 40 Post Options Post Reply Quote 5not4 Report Post Thanks(0) Quote Reply Topic: BGA Pad Size Posted: 27 Feb 2020 at 8:54am Tom. Can you explain how the tool calculates the footprint pad size for BGA's
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
mostly at the PCB side of the solder joints, with some fatigue crack initiation is found at the package side. Although package-side solder joint failures are typical in BGA thermal cycling experiments, PCB-side failures are known to occur with this
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