Industry Directory | Manufacturer
Duotec is a leading electronics manufacturing company in Arteaga, Coahuila, Mexico, specializing in SMT manufacturing, soldering solutions, chemical applications, and box build assembly.
Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske
In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t
Electronics Forum | Thu Dec 21 15:13:16 EST 2017 | georgetruitt
Is the process the same for every product running through the selective solder machine? Load program, acquire or set up fixture, Change/load flux?, Change/Load solder pot? Are the machines cold when the operators need to use them or are the machin
Used SMT Equipment | AOI / Automated Optical Inspection
Make: Vi Technology Model: 5K 3D AOI Vintage: 2017 Details: Precision XY Gantry High-Speed Linear Motors with Closed-Loop, High-Resolution Linear Encoders Automatic Conveyor Width Adjust Large Board! Max Bo
Used SMT Equipment | AOI / Automated Optical Inspection
VI Technologies 3D AOI machine (2016) Type: 5K SPECTRO Large Board AOI Solution 230V, 690 Watts, 3 Amps, 50 Hz lightly used unit 3D Single Lane Automated Optical Inspection System Precision XY gantry High-speed linear motors with closed loop
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2015-07-06 10:34:12.0
The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.” This special feature will take place during both days of the SMTA International Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois on September 29 - 30, 2015.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Career Center | la jolla, California USA | Engineering
More than 18 years experience in AOI. Refer to my resume for more details.
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Soldering of SMD Film Capacitors in Practical Lead Free Processes If you don't see images, please visit online version at: http://www.smtnet.com/express/ News Forums Equipment Mart Company Directory Event's Calendar Career Center Advertising
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
mostly at the PCB side of the solder joints, with some fatigue crack initiation is found at the package side. Although package-side solder joint failures are typical in BGA thermal cycling experiments, PCB-side failures are known to occur with this
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=7
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Cold Bump Pull Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or
