Electronics Forum | Sat Aug 25 23:01:45 EDT 2012 | ssridhar
Hello jdumont, I think the spheres are leaning as there is not enough meat under the spheres. In ceramic BGA devices there is a solder fillet which is generally a solder paste which is used to give the device some height before balling it. This heig
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
Used SMT Equipment | Pick and Place/Feeders
Dear Customer, We have the machine as below for sales, Model: KE 2070 L Vintage: 2010 No Feeder Please contact us if you are interested. Regards Michael var LEO_HIGHLIGHTS_INFINITE_
Used SMT Equipment | Pick and Place/Feeders
Dear Customer, We have the following machine for sales, Model: KE 2080 L Vintage: 2010 No Feeder C/W Tray unit Please contact us if you are interested. Regards Michael var LEO
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