Industry Directory | Manufacturer / Other
Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications.
Industry Directory | Manufacturer / Manufacturer's Representative
resellers of electronic manufacturing equipment and other scientific equipment qmsi.com
Electronics Forum | Sat May 05 08:00:54 EDT 2007 | davef
Continuing with CF's point on mixed alloy processing of BGA, look here: http://www.aciusa.org/leadfree/LFS_SUMMIT-PDF/09_HILLMAN_Rockwell_Collins_BGA.pdf
Electronics Forum | Mon Nov 05 19:43:09 EST 2007 | davef
"Effects of surface finish on high frequency signal loss using various substrate materials" - Call Don Cullen at Mac Dermid or Larry Gatewood at Rockwell Collins for a copy.
Industry News | 2009-12-03 22:49:57.0
Gene F. Wakefield Passed away on November 29, 2009 after a courageous battle with pancreatic cancer. He was born on December 22, 1933 in Albuquerque, New Mexico. He is survived by his wife, LaJuana. He leaves behind a daughter, Marvel Wakefield (Los Angeles, CA), two brothers, John Wakefield (Crawford, CO) and Roy Wakefield (Truckee, CA), three sisters, Lila Craig (Colorado Springs, CO), Mary Alyce Krist (Ft. Collins, CO) and Margaret Ann Foss (Buffalo, WY).
Industry News | 2003-04-21 10:09:08.0
New Sales, Marketing Channel for Emerging EDA Companies
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2010-10-21 16:01:17.0
Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level of conventional high voltage resistors which are generally availab
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Huntsville Chapter Technical Meeting: Evaluating Conformal Coatings
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Wed Apr 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Reliability Forum: Manufacturing High-Performance Products
Career Center | Lake Forest, California USA | Engineering
This is an exciting opportunity for a mid level Manufacturing Engineer with excellent growth potential. The company, located in Fort Collins, CO, is first class organization with a very stable environment. As a Manufacturing Engineer you will suppo
Career Center | , Colorado USA | Engineering
This is an exciting opportunity for a mid level Manufacturing Engineer with excellent growth potential. The company, located in Fort Collins, CO, is first class organization with a very stable environment. As a Manufacturing Engineer you will suppor
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_Brochure_PCD.pdf
SI/EMI applications. Stephen Chavez, Advanced Certified Interconnect Designer USMC Proud Marine, 29+ years of experience and currently serves as a Collins Aerospace Staff Engineer - Global Technical Lead of PCB design, Electronic Systems Center (ESC
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/news-releases/value-plastics-improves-material-transfer-with-new-bag-port-technology
resin meets all biopharm requirements, saves time and reduces costs 23 January 2012 - Fort Collins, Colorado, USA - Value Plastics, a Nordson Company (Nasdaq: NDSN
winsouce.jpg)