Industry Directory | Consultant / Service Provider / Manufacturer
TRC Circuits provides high quality printed circuit boards to a wide range of industries. We have 23 years of experience manufacturing printed circuit boards.
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New Equipment | Rework & Repair Equipment
The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus
Electronics Forum | Sat Nov 08 08:16:45 EST 2003 | davef
We saw this quite a bit, I want to say 5 or 6 years ago, but it's probably more like 10 years ago. It's caused by poor solder mask crue. Talk to your board fabricator about solutions.
Electronics Forum | Fri Nov 07 12:48:31 EST 2003 | rholland
I have seen in the last couple of months more boards with a white hazing under the solder mask. I ran a few tests on a board to determine the cause of the white hazing underneath the solder mask. First I confirmed, or at least I think I confirmed, t
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
. A real good example of this is Flexible Circuit Boards where it is best practice to solder mask define the Toe and Heel but not the side for the purpose of improving the pad adhesion to the Flex surface
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Drawbridging See Tombstoning . E ENIG Surface finishing process of electroless nickel followed by immersion gold. During soldering the gold is dissolved into the solder joint
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