Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
Industry Directory | Manufacturer
EMSYDEL Electronics is a India based EMS services company capablae of working with complex Boards using SMT, THT lead free services. Run by technocrats , EMSYDEl differentiates itself through a planned and Tailored client benefits association.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
Electronics Forum | Fri Nov 03 11:27:49 EST 2006 | kennyg
Does anyone know of a source for salvaging column grid arrays with damaged columns (through bad handling or removed from a PCBA)? Not reballing, but recoluming.
Electronics Forum | Wed Feb 06 07:18:47 EST 2019 | SMTA-Bob
I am looking for some old scrape boards that have either CCGA or CBGA, high temp columns or balled devices for some process experiments I am doing. If anyone has some please let me know, the company name or supplier will not be see or used Many than
Used SMT Equipment | Pick and Place/Feeders
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
Industry News | 2010-04-10 02:07:54.0
IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.
Industry News | 2020-02-18 14:13:29.0
Michael Ford, Dale Lee, Joe O’Neil and S. Manian Ramkumar honored for their on-going leadership in IPC and the electronics industry
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
-off-the-shelf ball/column grid array packaging (COT
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Robert Darveaux, Amkor Electronics, Arizona "Thermal and Power Cycling Limits of PBGA Assemblies" 1994: Donald R. Banks, Motorola Semiconductor Division, Texas "Assembly and Reliability of Ceramic Column Grid Array" 1993: Reinard J
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint
