New Equipment | Test Equipment
Fully refurbished with warranty. We provide a test results report to verify that the instrument meets all relevant specifications. Customized to run your method. GC Models: 7890 6890 A 6890 Plus 6890 N 6850 5890 Series II Plus 5890 Series I
New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
Electronics Forum | Mon Apr 09 16:48:27 EDT 2007 | ratsalad
How wide are your pads? What paste are you using? What is your board finish? Could you please post a link to the datasheet for the component? We place a lot of MLFs, both in a Pb and Pb-free process. Our standard stencil design for MLF compon
Electronics Forum | Tue Sep 16 12:39:41 EDT 2008 | stepheniii
You will have to make new programs for the Panasonic. (afaik) But you can use the Mydata programs as centroid data for the Panapro. Load it into Excell using space as the delimiter. Copy column B onto column A. cell A1, move cells up. Sort by column
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2020-11-17 11:26:03.0
TopLine Corporation will exhibit in the 58th annual IEEE Nuclear and Space Radiation Effects Conference (NSREC), which will have its first Virtual Conference and Exhibition beginning November 29 and accessible through December 30. Live virtual Exhibits will be accessible December 1-8.
Parts & Supplies | Assembly Accessories
Long term spot supply: Samsung's original new SM/CP Feeder: 8 * 2mm 8 * 4mm 12mm 16mm 24mm 32mm 44mm 56mm Samsung original new SME Feeder: 8mm -56mm Samsung original new TN suction: TN040 TN065 TN140 TN220 TN400 TN400N TN750 TN1100 Samsung or
Parts & Supplies | Assembly Accessories
Supply Samsung SM Feeder Accessories: feed gear, pressure cover, lock buckle, cylinder, Feeder control card, sensor power line, spacing screw, sliding track, one-way bearing, plastic wheel, guide pulley, small roll pulley assembly, Spring, Feeder&nbs
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Scienscope video coordinate measurement machines are specifically designed for non-contact measurement and inspection of small intricate features on small or large parts. These video measurement systems are a natural step up from measuring microscope
Events Calendar | Fri Apr 16 00:00:00 EDT 2021 - Fri Apr 16 00:00:00 EDT 2021 | ,
Auburn University Student Chapter Event: Get Hired in Electronics Industry
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
-off-the-shelf ball/column grid array packaging (COT
| https://www.eptac.com/ask/j-std-001-3-2-2-solder-purity-maintenance/
: We build components, and we would like to get your suggestion on which max limit column to follow. I am thinking Assembly Max Contaminant, due to the fact that we strip and tin, and solder connections to our components
Heller Industries Inc. | https://hellerindustries.com/small-curing-oven/
Small Footprint Curing Oven -Heller Home » Vertical Curing Ovens » Small Footprint Vertical Curing Oven VCO 722 Vertical Curing Oven VCO 722 Small Footprint Vertical Curing Oven A small footprint vertical curing oven with a single column requiring less than 4 feet of cleanroom space. Oven Size (mm): 1874(L) x 1150(W) x 2256(H
