Industry Directory | Manufacturer / Manufacturer's Representative
Electronic manufacturing, PCB assembly, Components part stock/sourcing. PCB fabrication
Industry Directory | Manufacturer's Representative
Our new protective coating service is a scientific breakthrough to enhance the metallic surface of electric contacting components, PCB, etc. to prevent corrosion. We also recycle parts like prober pins, test boards, test sockets, etc. that lost their conductivity due to wear. Gauranteed to save money for your company.
New Equipment | ESD Control Supplies
BEST Inc. can provide your custom foam cutting insert needs. Whether you have an anti-static (pink) closed or open foam packaging material or other kind of foam that needs to be cut-BEST Inc. can be your source. Once you have the materials in hand yo
YAMAHA YG200 Refurbished High Speed SMT Machine Model YG200 Applicable PCB L330×W250 mm to L50×W50 mm Through-put (Optimum) 45,000 CPH, 0.08 sec/CHIP equivalent
Used SMT Equipment | Chipshooters / Chip Mounters
YAMAHA YG200 Refurbished High Speed SMT Machine Model YG200 Applicable PCB L330×W250 mm to L50×W50 mm Through-put (Optimum)
Used SMT Equipment | Pick and Place/Feeders
YAMAHA YG200 Refurbished High Speed SMT Pick And Place Machine Applicable PCB L330×W250 mm to L50×W50 mm Through-put (Optimum) 45,000 CPH, 0.08 sec/CHIP equivalent Mounting accuracy Yamaha's standard components Absolute accurac
Industry News | 2003-03-18 10:12:41.0
The Falcom JP7 is a single-board GPS receiver with 12 parallel channels.
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Productivity On the Fly mounting method Identifies components without stopping while moving after picking them up Dramatically reduces travel time between the pick and place position and reduces identification time to zero Performance Dual-lane tra
Events Calendar | Wed Jun 07 18:30:00 UTC 2023 - Wed Jun 07 18:30:00 UTC 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Career Center | San Diego, California USA | Sales/Marketing,Technical Support
Do you want to put your dent in the universe? Are you are tired of being part of a slow moving bureaucratic coatings organization that sells old technology, can’t get things done and seems to create processes to hinder the selling process? Are y
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
SMTnet Express, July 7, 2022, Subscribers: 25,345, Companies: 11,579, Users: 27,324 █ Electronics Manufacturing Technical Articles What Does Industry 4.0 Actually Deliver Today? Example Reflow. Industry 4.0 is one of the most exciting
America, especially Sn3.0Ag0.5Cu (SAC305), the
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
blade which causes the component to drop into the component bin for retrieval. 5.1.2 Station Function Summary Stations 1 through 9 are operator adjustable. The following defines each Station's function and action on axial component elements. See 2.1 Part
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/how-do-you-close-component-view_topic339_post744.html
How Do You Close Component View? - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login How Do You Close Component View
