Industry Directory | Manufacturer / Manufacturer's Representative
Electronic manufacturing, PCB assembly, Components part stock/sourcing. PCB fabrication
Industry Directory | Manufacturer's Representative
Our new protective coating service is a scientific breakthrough to enhance the metallic surface of electric contacting components, PCB, etc. to prevent corrosion. We also recycle parts like prober pins, test boards, test sockets, etc. that lost their conductivity due to wear. Gauranteed to save money for your company.
New Equipment | ESD Control Supplies
BEST Inc. can provide your custom foam cutting insert needs. Whether you have an anti-static (pink) closed or open foam packaging material or other kind of foam that needs to be cut-BEST Inc. can be your source. Once you have the materials in hand yo
New Equipment | Board Handling - Conveyors
PCB destacker and PCB magazine destacker and SMT destacker are used to receive the bare board from the SMT assembly line,that save more production coat than the PCB magazine unloader. If you want know more solution for the SMT manufacturing line,
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Used SMT Equipment | Pick and Place/Feeders
Productivity On the Fly mounting method Identifies components without stopping while moving after picking them up Dramatically reduces travel time between the pick and place position and reduces identification time to zero Performance Dual-lane tra
Used SMT Equipment | Repair/Rework
Warranty: 90 days parts & labor against manufacturing defects - wear items not included 1IR550A000A67 1 PC IR550A Infrared Rework System - 115V/US 1600 W heating power -800 W bottom side - 135 x 260 mm -800 W top side - 60 x 60 mm
Industry News | 2003-03-18 10:12:41.0
The Falcom JP7 is a single-board GPS receiver with 12 parallel channels.
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Productivity On the Fly mounting method Identifies components without stopping while moving after picking them up Dramatically reduces travel time between the pick and place position and reduces identification time to zero Performance Dual-lane tra
Events Calendar | Wed Jun 07 18:30:00 UTC 2023 - Wed Jun 07 18:30:00 UTC 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Career Center | San Diego, California USA | Sales/Marketing,Technical Support
Do you want to put your dent in the universe? Are you are tired of being part of a slow moving bureaucratic coatings organization that sells old technology, can’t get things done and seems to create processes to hinder the selling process? Are y
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
SMTnet Express, August 23, 2018, Subscribers: 31,271, Companies: 11,024, Users: 25,118 Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications Bhupender Singh, Gary Menezes, Scott
| http://etasmt.com/cc?ID=te_news_bulletin,14961&url=_print
. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-expert-2021-09-released_topic2951.html
– in the SOIC component family, the program was adding an extra X after the pin pitch. Master FPX File Name – when the master FPX file name was longer than 20 characters, the program was throwing an Unhandled Exception Error. Pad Stack Rules
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