New Equipment | Board Handling - Conveyors
Microcomputer control, stable and reliable. >LCD screen display, menu interface, the man-machine dialogue is convenient. >Many sound-light alarm function. >So can use standard feeder, strong commonality. >According to the thickness of the PCB so
Our S Range silicone rubbers combine excellent environmental protection with a high level of shielding effectiveness. These products incorporate a matrix of vertically oriented wires which pierce both flat faces of the elastomer and provide around 10
Electronics Forum | Fri Dec 27 13:16:18 EST 2019 | slthomas
Can you describe the failure mode of the soldering defect, i.e., is it failing to meet the height requirement for a castellated termination due to not wetting of the component terminations, or not wetting the pads sufficiently, or....? We install a
Electronics Forum | Fri Dec 27 12:47:21 EST 2019 | ameenullakhan
Dear Team, We are facing open solder issue in a sensor component. Rejection rate is 2 out of 50 components placed. The issue is very random. We have tried increasing the solder paste height from 5 mil to 7 mil. The issue persist still. Differen
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2008-03-25 23:53:54.0
Comment from Brian D�Amico, President
Technical Library | 2015-04-29 03:48:39.0
SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process 3D inspection on the assembly line. SPI systems measure the height and volume of the solder pads before the components are applied and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to the SPI measurement is the accuracy of the height measurement because that has a direct correlation with solder volume and defects.
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Good Quality Hot Air Lead Free Led Reflow Oven in SMT Line ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | pro
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SMTnet Express, June 11, 2015, Subscribers: 22,861, Members: Companies: 14,392 , Users: 38,338 Solder Paste Stencil Design for Optimal QFN Yield and Reliability B. Gumpert; Lockheed Martin Corporation The use of bottom terminated components (BTC
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/mixers/in-line-metal-mixers
In-Line Metal Two-component Mixers | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
/91 Specifications2-9 Figure 9 Vertical Component Elements 2.2.4 Processing Ranges (continued) In the figure and chart below: B = Body to Bend H = Height of Leg C = Crimp Height R = Bend Radius Vertical Components Inches Metric (mm) Dimension Minimum
