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EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018
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Electronics Forum | Mon Jul 29 08:34:40 EDT 2013 | gallionc
I don't see an issue. As was mentioned before, it is what the customer wants. You could approach this from one of two ways. You could simply install the parts, clinch the leads on the opposite side for added mechanical strength and solder the parts
Electronics Forum | Thu Oct 18 11:59:38 EDT 2012 | jackofallmasterofnone
1) At this time we do not have a design engineer. I have contacted the PCB manufacturer about changing the drill file to close up the diameter on the holes a bit. This should allow the wings on the leads of the component to rest on top of the holes i
Used SMT Equipment | THT Equipment
Save on hard to find General Production Devices CF-9/CF-10 radial lead component cut and form die sets lot. Domestic and international shipping is available.
Used SMT Equipment | THT Equipment
Save on hard to find General Production Devices CF-9/CF-10 radial lead component cut and form die sets lot. Domestic and international shipping is available.
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
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High Quality Selective Wave Soldering Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. wave soldering, wave soldering machine, D
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New Product Introduction & Product dovelopment
Fundamentals of Solder Paste Technology Fundamentals of Solder Paste Technology Solder pastes are key materials in surface mount technology (SMT) for assembly of printed circuit boards (PCBs). Introduction of lead-free has placed new demands
THT in-line Inspection: Contradiction or greater Efficiency? THT in-line Inspection: Contradiction or greater Efficiency? The utilisation of Automated Optical Inspection systems has become an integral part in quality assurance of electronic
ASCEN Technology | https://www.ascen.ltd/Blog/Solutio/567.html
choose.ASCEN electronic axial component lead forming machine has a reputation for reliable, economical performance in thousands of PCB assembly factories worldwide
| https://www.eptac.com/faqs/ask-helena-leo/ask/gullwing-lead-deformation
% of the diameter, width, or thickness of the lead, they cannot be used. The 001 Handbook states on page 58, section 7.1.1 Lead Deformation: “After forming, component leads may be deformed up to 10
