Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
For over 30 years, V-TEK International has been a global leader in the electronic component packaging and processing industry by providing cost-effective component packaging and processing options with fast return on investment.
Industry Directory | Manufacturer
MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F
Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �
Electronics Forum | Thu Jun 12 00:28:28 EDT 2014 | ericchien
Hi Martin, Just wondering do you wish to test the component? I and my company may identify what is the foreign contaminants of it. Most probably is the flux deposits though. Anything you want to inspect you might get to me at +65 94870818.
Used SMT Equipment | General Purpose Test & Measurement
Measurements up to 200V and 1A, 20W Power Output The Model 2400-C SourceMeter is a 20W instrument that allows sourcing and measuring voltage from +/-5 MicroV (sourcing) and +/-1 MicroV (measuring) to +/-200V DC and current from +/-10pA to +/-1A. It'
Used SMT Equipment | In-Circuit Testers
Keithley 2400-C Keithley 2400C General-Purpose SourceMeter Measurements up to 200V and 1A, 20W Power Output The Model 2400-C SourceMeter is a 20W instrument that allows sourcing and measuring voltage from +/-5 MicroV (sourcing) and +/-1 MicroV
Industry News | 2003-06-13 09:56:46.0
Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Oct 07 00:00:00 EDT 2019 - Tue Oct 08 00:00:00 EDT 2019 | ,
PCBA Cleanliness End-of-Project Webinar
| https://www.eptac.com/faqs/ask-helena-leo/ask/scoring-of-soldered-boards-with-online-testing
“pass” or “fail”. More SolderTips Visual Acuity Requirements for Soldering PEM® Nut Soldering Criteria Solder Flow Near Through-Hole Component Body Maximum Limits of Solder Bath Contamination Defining Standard Industry Practices for Torque of Threaded Fasteners Have a question
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
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