New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Sat Mar 13 19:34:17 EST 1999 | John W.
| | Okay, I would like to hear everyones ideas for PD naming conventions for FUJI. We are trying to use your basic names "3216_CAP" to a "MQFP208AD" But it is way out of control. Different part sizes, and vendors make it very tough to keep it all
Electronics Forum | Tue Sep 21 21:19:59 EDT 2021 | demradarmfg
Yes, and while it did, its been around longer than we have had any sort of process engineers. While the package naming scheme, or lack there of, is a mess. I am mostly curious if there is any other identifiers or naming conventions besides specific m
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti
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Used SMT Equipment | Pick and Place/Feeders
Yamaha YSM10 Pick And Place Machine Features: YSM series entry model mounter that achieved both the world’s fastest speed and versatility in its class worldwide! Ultimate basic machine featuring the three “1
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2018-01-06 23:40:50.0
Library Expert Enterprise library solution is used by some of the most prominent companies and household names in the world.
Parts & Supplies | Pick and Place/Feeders
Starting in May 2008, ＪＵＫＩ Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp
Technical Library | 2011-09-01 18:11:31.0
Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it, the objective is the same, namely the clean up of remaining solder after a component (particularly a BGA) or R.F. Shield has been removed from a PCB. This paper will describe the various methods that are available and discuss their pros and cons.
Technical Library | 2021-11-17 18:53:50.0
The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005.
In-line or stand-alone fluxer/pre-heater This compact modular in-line system utilises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single sold
Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
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IT Operations Analyst (M10097) Mountain View, CA As a IT Operations Analyst you will be responsible for the day to day operations of all Production Systems and Services to assure effective systems availability and performance needed to support overal
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BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.
SCAVENGING Scavenging Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/two-component-2k-materials?con=t&page=15
Two-component (2K) Materials | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
GPD Global | https://www.gpd-global.com/co_website/news-events-pr-506-1.php
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