Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Manufacturer
Engaged in OEM manufacture Rigid PCB(1-22layer, MCPCB,HDI PCB etc),PCBA,Flex PCB,Rigid-Flex PCB.
New Equipment | Education/Training
BEST offers a one of a kind mobile training center which allows the students to be sequestered inside the training center without outside distrction. In addtion the mobile traiing enter on wheels is a comfortabel place to train where all of the most
New Equipment | Fabrication Services
ENIG PCBs with red soldermask Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm Min. line width: 3 mils Min. line spacing: 3 mils Surface finishing: HASL
Electronics Forum | Fri May 17 17:57:10 EDT 2024 | yannick_herzog
Hello, We have problems with insufficient solder volume on a component. To solve this problem, we want to add more paste to the component. We have two options for this: 1. run a stencil with a step to achieve the required volume. 2. overprinting
Electronics Forum | Thu Jul 18 15:08:36 EDT 2024 | SMTA-64416281
We have an application requiring more than a single preform per component (PIP through hole socket). What we found out is that regardless of how much you overprint, the flux contained in the paste is not enough, so we ended up needing to dispense gel
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2011-01-12 17:48:44.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Technical Library | 2024-06-20 22:53:23.0
A leading electronic hearing device manufacturer reduced UV precise coating cycle time by 79% with advanced automation. A manual process of hand brushing UV coating onto components was replaced by an automated solution from Nordson to increase production volumes, improve quality, and reduce costs for this complex application. Download the paper to learn the details of the application.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
Events Calendar | Tue Jun 26 00:00:00 EDT 2018 - Thu Jun 28 00:00:00 EDT 2018 | College Park, Maryland USA
Symposium on Counterfeit Parts and Materials
Events Calendar | Wed Aug 19 00:00:00 EDT 2020 - Wed Aug 19 00:00:00 EDT 2020 | ,
DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
| https://unisoft-cim.com/cycle-times.html
PCB Cycle Times for Component Insertion on PC Board | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
| https://www.eptac.com/ask/problems-with-component-tombstone-on-flex-circuit/
Problems with Component Tombstone on Flex Circuit - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
