Industry Directory | Manufacturer
Manufacturer of batteries (particularly coin or button cells). Renata is a subsidiary of The Swatch Group.
Industry Directory | Manufacturer
Storagesolutions' automatic and intelligent component storage systems ensure a reduction of more than 50 percent setup time for pick-and-place equipment, complete certainty of the availability of the
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a
Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
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Used SMT Equipment | Pick and Place/Feeders
YAMAHA YSM20R(SV)-2 Mounter Basic technical parameters Substrate size: 50*50mm－810*490mm (single track) 50*50mm－810*230mm (dual track) Substrate height: 15m
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Industry News | 2003-05-21 08:21:19.0
Basic concepts for identifying the relevant contributions to uncertainty, and the calculation of total uncertainty from these contributions
Industry News | 2003-05-29 08:40:51.0
Withdrawal of Nam Tai's registration statement filed on Form F-3 for a proposed offering of 3,000,000 common shares of the company
Parts & Supplies | Pick and Place/Feeders
Equipment introduction: Fuji mounter AIMEX II: Fuji mounter AIMEX II is a multi-functional integrated mounter for various production forms from trial production to mass production. It has a large-capacity material station capable of carrying various
Parts & Supplies | Pick and Place/Feeders
Equipment introduction: Fuji mounter AIMEX II: Fuji mounter AIMEX II is a multi-functional integrated mounter for various production forms from trial production to mass production. It has a large-capacity material station capable of carrying various
Technical Library | 2021-06-07 19:06:32.0
The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC's weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB's ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs' ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.
Technical Library | 2021-07-28 18:35:13.0
The performance of electronic components is compromised by factors such as bubbles in the potting medium. Increasing numbers of applications – particularly in the automotive and electronics industries – therefore require completely bubble-free dispensing methods. This is where potting in a vacuum comes into focus. The widespread school of thought about this technology is that it is too complicated, too expensive and too slow. But a closer look shows that this view is incorrect. This is a mastered technology. As for costs, the calculation basis is key, since usually the potting and vacuum method is only considered after the required potting quality cannot be achieved reliably any other way. Under total cost of ownership assessments, higher system costs no longer play a key role, since component failure would result in much higher subsequent costs. And now there are proven solutions for high production volumes and/or shorter cycle times. This whitepaper explains when potting in a vacuum is ideal for your projects and what to be aware of.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
The ZEVAm+ selective soldering machine brings patented soldering technology that excels at meeting the challenges of miniaturization. Tilting allows the ZEVAm+ to solder at any angle to guarantee proper soldering results for the ever decreasing pitch
Training Courses | ONLINE | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Atlanta, Georgia USA | Engineering
Senior Designer Associates degree or equivalent technical certificate or equivalent experience, with an additional four years industrial design experience required. Strong communication skills required in dealing with customers and visitors to the fa
Career Center | Tampa, Florida USA | Accounting/Finance,Production,Purchasing
Reptron Manufacturing Services needs an experienced Assistant Buyer/Planner for their large contract manufacturing facility. The qualified candidate must be a self-starter with an understanding of PC board manufacturing and component procurement with
Career Center | Pune, Maharahtra India | Engineering,Maintenance,Technical Support
SMT Test Engineer/Electrical Automation Engineer. Good exposure on Agilent, Vitrox, Vi tech and TRI Aoi,s Good exposure on agilent ICTS and DAGE X rays.
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts. During QFP analysis, for example, the rotational accuracy can
| https://unisoft-cim.com/rotation-understanding-component-rotations.html
understanding component rotations. | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
perform the calculations and make minor adjustments to the settings after inspecting (measuring) sample formed components. 1. Identify the desired formed component elements in the figures accompanying the following calculation sections for the type of
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