Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Industry Directory | Manufacturer
The Future of Electronics is here - With Squink at your Desktop, print and assemble PCBs in minutes instead of weeks for less than a cup of coffee. Go from CAD design to PCB without the pain and cost.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
auto PCB depaneling machine adopts the latest blade-type light weight design, which completes the micro-shear stress cutting stroke at one time, and is suitable for separating PCB circuit boards with V-grooves. If you want know how to choose the b
Electronics Forum | Tue Aug 11 09:52:53 EDT 2015 | rgduval
I assume that these parts are falling off during second-side reflow? The easy solution, of course, is to not build high-mass components on first-side reflow. If this isn't practical, however, you can try using epoxy/glue under the component. We'
Electronics Forum | Wed Oct 18 08:00:53 EDT 2006 | davef
Have you tested the solderability of the inbound components per ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires?
Used SMT Equipment | Repair/Rework
Warranty: 90 days parts & labor against manufacturing defects - wear items not included 1IR550A000A67 1 PC IR550A Infrared Rework System - 115V/US 1600 W heating power -800 W bottom side - 135 x 260 mm -800 W top side - 60 x 60 mm 1 K-type themoco
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Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE300 (2004) Solder Paste Inspection Brand: Cyberoptics Model: SE300 Description: Solder Paste Inspection Serial: 10239 Year: 2004 Details: • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max pad size
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
Industry News | 2023-08-18 12:40:11.0
"DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD" is a leading SMT automation equipment factory provider in China. With many years of profound experience accumulation, we provides comprehensive solutions for global customers with strong resources and high-quality professional technical team.
Parts & Supplies | Assembly Accessories
amaha Mounter: also known as "mounting machine" and "surface mounting system", in the production line, it is a kind of equipment that can accurately place surface mount components on PCB pad by moving the mounting head after dispe
Parts & Supplies | Component Packaging
L140E321000 Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment JUKI E2047700000 CT BELT F JUKI E2047721000 DRIVE PULLEY F JUKI E2047725000 RAIL PLATE FL JUKI E2048700000 CT BELT R JUKI E2048721000 DRIVE PULLEY R JUKI E2048725000 RAIL PLATE F
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
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Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Reno, Nevada USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
Extensive technical background including tenures providing robotics technology expertise to diverse national and international clients and supporting surface mount technologies for printed circuit board (PCB) manufacturing processes. Results-oriente
Career Center | , | Engineering,Sales/Marketing,Technical Support
Applications Engineer with over 20 years of combined Manufacturing/Field Service/Applications Engineering experience in the SMT industry.
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
the component's lead. ! Stations 4 and 5 utilize dies which can be chosen to crimp component leads to form components like stand-off, lock-in, and cut-off for either vertical or horizontal forms, and horizontal under-form. In addition, dies can be
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-components-during-reflow-float-off-pads
mass of solder and pulls the leads off the pads, resulting in no heel fillets. The component lead land areas need to be longer to accept this movement of the component on the large thermal pad
