New SMT Equipment: component purple discoloration after reflow (1)

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

New Equipment | Rework & Repair Equipment

BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It

BEST Inc.

Electronics Forum: component purple discoloration after reflow (8)

discolored pbfree finish after bake and/or reflow

Electronics Forum | Thu Apr 20 22:14:51 EDT 2006 | raquel

hello! need ur inputs... if the Matte Sn pbfree finish of the component discolors AFTER having been exposed to bake, or, after reflow, will the base leadframe have any potential contribution to it? i know most likely suspects would be the plating pro

Black color solder wetting after reflow

Electronics Forum | Thu May 05 01:21:42 EDT 2011 | city4497s

Hi Davef The problem shows up on * random location including component pads * all PCB and different PCB supplier * different solder paste lot * both printing and dispensing process * all production shift * we have only 1 production line It black,

Videos: component purple discoloration after reflow (1)

HeatShieldGel(TM)

HeatShieldGel(TM)

Videos

To order, visit http://www.solder.net/products/heatshieldgel-tm/ BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic compo

BEST Inc.

Express Newsletter: component purple discoloration after reflow (1032)

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose

Partner Websites: component purple discoloration after reflow (2)

5 Signs Your PCB May Need to be Repaired or Replaced

Imagineering, Inc. | https://www.pcbnet.com/blog/5-signs-your-pcb-may-need-to-be-repaired-or-replaced/

. Check for damaged or broken traces on the PCB. Importance of Proper Soldering and Component Installation Improperly soldered components can cause many problems for your PCB, such as

Imagineering, Inc.


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