Industry Directory | Manufacturer
Micross Components is a leading global provider of specialty electronics solutions for defense, space, medical and demanding industrial industries. -
Industry Directory | Consultant / Service Provider
CCI is a highly recognized Electronic Test Laboratory that specializes in all types of component testing and services. Primarily Up-Screening, Characterization, Qualification, DPA, HSD and Tape & Reel
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
New Equipment | Education/Training
The J-STD-001 Space Electronics Hardware Addendum provides additional requirements over those published in IPC J-STD-001 to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic env
Electronics Forum | Thu Sep 12 18:54:21 EDT 2002 | scottefiske
PTH to SMT spacing should be 80-100 thous. any closer will result in bridging. Scott
Electronics Forum | Wed Aug 28 19:35:13 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Used SMT Equipment | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Used SMT Equipment | SMT Equipment
Product name: RX 7 high-speed module chip mounter Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, high quality new modular placement machine RX 7 listed Component placement speed (best con
Industry News | 2003-06-03 08:20:48.0
Designed for fast and easy DIN-rail mounting
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
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Parts & Supplies | Assembly Accessories
Samsung CP 8x2mm feeder for 0201 component More Samsung feeder parts in stock 125X40X133MM Samaung Thimble 300X56X66MM Samaung Soft Thimble Pin J1301023 Samaung Feeder Snap spring J7066039A Samaung Feeder Spring J8100123A Samaung CP45 8X4 Fee
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Parts & Supplies | Pick and Place/Feeders
Samsung CP 8x2mm new feeder(0201) More Samsung feeder parts in stock 125X40X133MM Samaung Thimble 300X56X66MM Samaung Soft Thimble Pin J1301023 Samaung Feeder Snap spring J7066039A Samaung Feeder Spring J8100123A Samaung CP45 8X4 Feeder upper
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Web:https://www.ascen.ltd/component_tape_feeder/ ,Robotic component tube feeder|SMT part tube feeder is a SMT taped stick tube feeder and developed for the customer required and that is not a standard machine.tube radial component feeder can output t
Web:https://www.ascen.ltd/component_tape_feeder/ ,Robotic component tube feeder|SMT part tube feeder is a SMT taped stick tube feeder and developed for the customer required and that is not a standard machine.tube radial component feeder can output t
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,
Electronics in Harsh Environments Conference - Free Pre-Conference Webinar
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | Littleton, Colorado USA | Engineering
If you have experience in Satellite Communications or RF Payload Engineering we have advancement opportunities that may be of interest to you. Available positions are in disciplines such as: Shaped Reflector design and analysis Antenna compo
Career Center | , Mississippi USA | Engineering,Production
About The Company: This company is a supplier of aerospace and defense products to the U.S. Government and its allies and major prime contractors. This company holds market leadership positions in munitions, smart weapons and precision capabilities
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
SMTnet Express, March 12, 2015, Subscribers: 22,490, Members: Companies: 14,252 , Users: 37,867 Miniaturization with Help of Reduced Component to Component Spacing Jonas Sjoberg, Ranilo Aranda, David Geiger, Anwar Mohammed, Murad Kurwa
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_3d-plus-component_topic1783.xml
PCB Libraries Forum : 3D Plus Component PCB Libraries Forum : 3D Plus Component This is an XML content feed of; PCB Libraries Forum : Questions & Answers
| https://unisoft-cim.com/crosschecking-pcb-component-footprint-and-bom-footprint.html
(correct solder pad size and land pattern) for the same component listed in the Bill of Materials (BOM). The mismatch of component footprint spacing is usually an error created when components on the PCB assembly ( PCBA
