Industry Directory: component terminal finish (74)

EPTAC Corporation

EPTAC Corporation

Industry Directory | Standards Setting / Certification / Training Provider

EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.

Mikuni Terminals Mechatronics Philippines Corporation

Industry Directory | Manufacturer

Manufacturer of Printed Circuit Board Assemblies, Module components and Card Readers.

New SMT Equipment: component terminal finish (947)

Time Pressure Liquid Dispensing Pump with Foot Switch or Dry Contact

Time Pressure Liquid Dispensing Pump with Foot Switch or Dry Contact

New Equipment | Dispensing

Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo

GPD Global

Hand Soldering Training

Hand Soldering Training

New Equipment | Education/Training

The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo

Blackfox Training Institute, LLC

Electronics Forum: component terminal finish (1027)

Solder splash from component terminal

Electronics Forum | Sun Feb 12 22:52:20 EST 2017 | ltchsze

Hi fellow professionals, Wondering whether anyone has experience with solder splashing from component terminal. Have identified the source using the component without printing solder paste on PCB. Wondering the root-cause of the solder splashing fr

Solder splash from component terminal

Electronics Forum | Tue Feb 21 16:39:03 EST 2017 | ltchsze

Thanks for input, dyoungquist. The condition here is without any flux or paste applied. Solder from component terminal started splashing by itself when put through re-flow.

Used SMT Equipment: component terminal finish (19)

Juki KE - 2070

Juki KE - 2070

Used SMT Equipment | Pick and Place/Feeders

Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki  KE - 2080

Juki KE - 2080

Used SMT Equipment | Pick and Place/Feeders

Product name: KE - 2080 JUKI high-speed chipmounter Product number: KE - 2080 Detailed product introduction Characteristic: Small components of high speed SMT capacityand IC or complex shape abnormity components of high precision SMT ability andg

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: component terminal finish (922)

GPD Global to Focus on PCD Dispensing at ATX West 2011

Industry News | 2011-01-12 17:48:44.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

GPD Global

GPD Global to Promote PCD Dispensing at the SMTA Dallas Expo & Tech Forum

Industry News | 2011-02-04 01:47:14.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.

GPD Global

Parts & Supplies: component terminal finish (37)

Yamaha Manual Component Lead Cut Bend

Parts & Supplies | SMT Equipment

Manual Component Lead Cut Bend QY-306B Specifications   Lead Forming Machine Lead Former is used to lead cutting and forming of taped, bulk resistors, diodes,and other axial components          FEATHERS    1.  This lead fomring mac

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Technical Library: component terminal finish (49)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage

Technical Library | 2017-06-01 17:12:08.0

The corrosion of Nickel-Palladium-Gold (Ni-Pd-Au) finish terminals in humid environments is known to be reduced with the application of a conformal coating such as acrylic. Corrosion has a higher rate of occurrence around the terminal ‘knee’ of a surface mount component, which may be reduced with the application of conformal coatings. Although radio frequency (RF) plasma processing is generally known to enhance conformity of conformal coating to surfaces through ionic bombardment, the effect on the functionality of assembled printed circuit boards (PCB) is not as well known. The purpose of this study is to assess whether RF plasma processing can enhance the adhesive and coverage qualities of an acrylic conformal coating on PCBs, specifically on Ni-Pd-Au terminals with a knee, and if plasma processing has an effect on the electrical functionality of components and fully assembled PCB.

MARCH Products | Nordson Electronics Solutions

Videos: component terminal finish (114)

axial component de-taping,axial de taping machine,axial component former,component lead formmer

axial component de-taping,axial de taping machine,axial component former,component lead formmer

Videos

https://www.ascen.ltd/Products/Component_lead_forming_machine/564.html ASCEN axial component de taping machine component axial lead former use for unloading tape for the taped axial component. Separation the tape of the taped axial lead component tha

ASCEN Technology

auto component de-taping,axial de taping machine,axial component former,auto axial lead former

auto component de-taping,axial de taping machine,axial component former,auto axial lead former

Videos

https://www.ascen.ltd/Products/Component_lead_forming_machine/564.html ASCEN axial component de taping machine component axial lead former use for unloading tape for the taped axial component. Separation the tape of the taped axial lead component tha

ASCEN Technology

Training Courses: component terminal finish (116)

Certified IPC Specialist (CIS) Course IPC/WHMA-A-620 with Supplemental Hands-On "Requirements and Acceptance for Cable and Harness Assemblies"

Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)

The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.

Blackfox Training Institute, LLC

IPC J-STD-001 Specialist (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Specialist (CIS)

The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.

Blackfox Training Institute, LLC

Events Calendar: component terminal finish (11)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Surface Mount Technology Association (SMTA)

Career Center - Jobs: component terminal finish (20)

Sr Designer

Career Center | Atlanta, Georgia USA | Engineering

Senior Designer Associates degree or equivalent technical certificate or equivalent experience, with an additional four years industrial design experience required. Strong communication skills required in dealing with customers and visitors to the fa

Focus Enterprises

Inspector

Career Center | Phoenix, Arizona USA | Quality Control

Growing contract electronic manufacturer looking for quailified inspectors.  We specialize in printed circuit board and box-build/cable assemblies.  We operate a very fast-paced, dynamic business where we cater to quick-turn work.  We need experience

Triad Electronic Technologies

Career Center - Resumes: component terminal finish (26)

SMT Manufacturing

Career Center | , | Engineering,Maintenance,Production

Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma

Electronics

Career Center | Springdale, Arkansas USA | Production,Research and Development

solder, electronic assembly, pcb repair, wave solder, smt, solder pot, testing unit,dexterity, program IC's,the rest in resume

Express Newsletter: component terminal finish (799)

XTECH Auctions announces ETM Auction ☀ October 17–21 - 2021 SMTnet Express, October 21

XTECH Auctions announces ETM Auction ☀ October 17–21, 2021 SMTnet Express, October 21, 2021, Subscribers: 26,585, Companies: 11,455, Users: 26,807 PCB Surface Finishes & The Cleaning Process - A Compatibility Study All PCBs

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder

Partner Websites: component terminal finish (2677)

Silver Immersion Finish Boards - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/silver-immersion-finish-boards

Silver Immersion Finish Boards - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

4917 - TERMINAL BLOCK

Heller Industries Inc. | https://hellerindustries.com/parts/4917/

4917 - TERMINAL BLOCK Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.


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Formic Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications
Selective Soldering Nozzles

Training online, at your facility, or at one of our worldwide training centers"
Electronics Equipment Consignment

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
used smt parts china

Component Placement 101 Training Course