1052 component weight versus pad size during adhesiveless double sided reflow results

Electronics Forum: component weight versus pad size during adhesiveless double sided reflow (1)

Reflow X2

Electronics Forum | Thu Nov 01 17:42:45 EST 2001 | davef

Wolfgang is correct. Search the fine SMTnet Archives to find information on the component weight versus pad size during adhesiveless double sided reflow. Do not mess with different solder materials.

Express Newsletter: component weight versus pad size during adhesiveless double sided reflow (1051)

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

Featured Article Return to Front Page REFLOW SOLDERING

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo


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