Industry Directory | Manufacturer
Load Cell Central is an experienced load cell and load cell-based weighing system manufacturer. Whether you're in need of industrial scales, a load cell, or solutions for force measurement, we can help.
Industry Directory | Distributor
SeeMe Technology Co., LTD is specializing in selling all global brands of electronic components.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
YAMAHA YG200 Refurbished High Speed SMT Machine Model YG200 Applicable PCB L330×W250 mm to L50×W50 mm Through-put (Optimum) 45,000 CPH, 0.08 sec/CHIP equivalent
Used SMT Equipment | Soldering - Wave
2005 Speedline Technologies Vectra 450F Wave Solder Note: The solder pot is full of lead-free solder. The weight of this solder is estimated at 1600 lbs. Item Location: Westerville, OH USA Serial: 498509 Features: Ultra Fill Lead-Free OptiFlux II Int
Used SMT Equipment | SMT Equipment
Model :KE-2010 Mounter Placement speed：11000CPH Max PCB size :KE2010M,330mm/250mm；KE2010L,410mm/360mm；KE2010E,510mm/460mm Station:80 Component range :8mm-72mm Strip, bulk material Placement accuracy: CHIP ±0.08mm Power supply:three-phase 220V~3
Industry News | 2003-05-21 08:21:19.0
Basic concepts for identifying the relevant contributions to uncertainty, and the calculation of total uncertainty from these contributions
Industry News | 2016-02-15 09:46:51.0
Count On Tools has released a new accessory – the Lightweight Rails – for its award-winning line of StripFeeder products. The StripFeeder Lightweight Rails enable customers to take full advantage of the StripFeeder platform when operating in OEM tray towers with weight limits on tray capacity. The skeletonized design reduces carrier tray weight by 40-50 percent. StripFeeder Lightweight Rails are available in 0.25" (6mm), 0.50" (12mm), 0.75" (19mm), and 1.125" (28mm) pocket depths.
Technical Library | 2014-08-14 17:58:41.0
High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic. This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.
Technical Library | 2018-07-18 16:28:26.0
Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented
KS6V LED Placement Machine Domestic Applicable to: fluorescent tubes,flexible light strips,flat lights,outdoor lights,ceiling lights, bulbs,terminals,power supplies,etc. Product name 6V (six head placement machine)
KS10V LED Multi-head SMT Machine Applicable to: modules,fluorescent tubes,flexible light strips,outdoor lights,power supplies, ceiling lights,panel lights,back lights,etc. Specification: Product name KS 10V(ten head placeme
Events Calendar | Wed May 12 18:30:00 UTC 2021 - Wed May 12 18:30:00 UTC 2021 | ,
Joint Chapter Meeting: Photonic Soldering
Events Calendar | Sun Aug 23 18:30:00 UTC 2020 - Thu Aug 27 18:30:00 UTC 2020 | Virtual Event, USA
Adhesives & Bonding Expo Connect
Career Center | Manhattan, Kansas USA | Production
Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
Career Center | , Czech Republic | Engineering
CLIENT - International technology products manufacturer with manufacturing (high mix and medium/high volume - broad range of manufacturing processes), in Brno, CZ ROLE - SMT Engineer provide technical support and guidance to an inexperienced SMT
Career Center | , Philippines Philippines | Maintenance
ARIEL C. TADIOSA Phone Number : 09276111216 E-mail address : atadiosa2004@yahoo.com Mailing address : Blk. 10 Lot 53 Celina Homes Technopark Brgy. Loma Binan, laguna Position Applied For : Equipment Tec
Career Center | Binan,Laguna Philippines, Philippines | Maintenance
Phone Number : 09276111216 E-mail address : atadiosa2004@yahoo.com Mailing address : Blk. 10 Lot 53 Celina Homes Technopark Brgy. Loma Binan, laguna Position Applied For : ___________________________________________________
decade, depositing adhesives for SMT components on th
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/plural-component-systems?con=t&page=23
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