InspectScan VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in setting up processes before the production floor in the PCB or Hybrid Microcircuit assembly industries. InspectScan
The YSC HD-PAD is the perfect tool for quick and immediate inspection needs. This inspection magnifier provides crystal clear images for the user. Its compact and ergonomic design is comfortable to hold and highly intuitive to use. The display deli
Electronics Forum | Thu Nov 01 17:42:45 EST 2001 | davef
Wolfgang is correct. Search the fine SMTnet Archives to find information on the component weight versus pad size during adhesiveless double sided reflow. Do not mess with different solder materials.
Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F
Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b
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Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE300 (2004) Solder Paste Inspection Brand: Cyberoptics Model: SE300 Description: Solder Paste Inspection Serial: 10239 Year: 2004 Details: • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max pad size
Used SMT Equipment | Screen Printers
MPM APB HiE 2d vision Understencil Cleaner Fine Pitch Year 2000 *Print Area: 2” x 2” to 18” x 16” *Board Size: 2” x 2” to 20” x 16” *Stencil Frame Size: 29" x 29" *Vision Specifications: Viewing Capability: 17.5” x 16” Field o
Industry News | 2003-04-15 08:23:22.0
Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.
Industry News | 2009-09-17 14:28:17.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
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Size Does Matter – Breaking the Barriers of Wafer Level Packaging-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/filling-systems?con=t&page=14
% shorter than comparable two-component disposable square mixers with 30% less retained volume. Nordson EFD Introduces the Contact versus Jet Dispensing White Paper Nordson EFD Find out the differences between the two most common dispensing methods to improve fluid application success. New Optimum®
