Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Salescon Ltd is operating for 20 years. Supplying various materials,tools machines for the electronic industry. Supplier for manufacturer companies in Hungary and CEE,providing services for SMEs and start-up businesses.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
Electronics Forum | Wed May 21 12:26:24 EDT 2003 | Michael Ling
If I need to test whether our products can withstand the solder reflow process, is there any tests that I can perform other than putting the products through the actual relfow process.
Electronics Forum | Thu May 22 00:21:27 EDT 2003 | AlCapone
The alternative is by looking at all your components data specs (heat-range), especially pay more attentions to heat-sensitive comps, and fine-pitch comps, odd-form comps, draw a diagram on a separate sheet of paper shown that temperature VS those ca
Used SMT Equipment | General Purpose Test & Measurement
Optical Spectrum Analyzer Agilent 86142B Optical Spectrum Analyzer. Passes self test - no option. Best suited for WDM component and system test applications where power and wavelength accuracy, dynamic range and low polarization dependency are criti
Used SMT Equipment | Pick and Place/Feeders
Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2012-04-06 15:32:39.0
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.
Parts & Supplies | Screen Printers
Name: 990314 MPM stencil measuring height; scraper height of the entire set of measured components; including cylinders, motors, contact switch Part Number: 990314 MPM stencil measuring height; scraper height of the entire set of measured compone
Parts & Supplies | SMT Equipment
Wipe components PAPE SPINDLE (145894) Wipe components PAPE SPINDLE (145894 if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skyp
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2019-06-18 10:18:00.0
ACI Technologies is tasked with decapsulation of electronics components for testing and investigative purposes. In the normal method of decapsulation, an analyst will drill a small indentation, with a rotary tool, in the hermetic sealant material and then apply Nitric acid to eat through the polymeric encapsulant.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Wed Aug 19 00:00:00 EDT 2020 - Wed Aug 19 00:00:00 EDT 2020 | ,
DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | West Melbourne, Florida USA | Production
Provide technical support in all areas of manufacturing in support of in-circuit and functional test. Debug printed circuit boards and product level assemblies to the component level. Work from test procedures, electrical schematics, technical note
Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
Career Center | Damascus, Syria | Engineering,Maintenance,Production,Technical Support
Experience : 1- PCB Test Engineer For Telecom Products And TV - LCD Manufacturing as follow : - In-Circuit and Automatic Test Equipment Test - in-circtuit Emulator - Function Test - Automatic Optical Inspection Test - Toubleshooting Axial
| https://www.eptac.com/webinars/understanding-solderability-testing-for-printed-circuit-boards-and-components
Understanding Solderability Testing for Printed Circuit Boards and Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/peel-testing?con=t&page=7
Energy Nordson DAGE Nordson DAGE Bondtester and X-ray systems are widely used for precision destructive and non-destructive testing and inspection where electronics and mechanical components are involved
