Advanced Nonmetallic Carbon Product and Material Technologies for the Acquisition, Directional Transport and Dissipation of Thermal Energy
Industry Directory | Manufacturer
TxV manufactures polyketone composite parts and assemblies for commercial aerospace. Combining world-class expertise in materials & manufacturing to deliver composite structures such as brackets...
Through the process of CNC routing, we are able to cut with precision electronic insulation products including thicker gauge materials. We also process composite materials such as G-10, FR4 and other materials that are not easily die cut.
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Electronics Forum | Sat Feb 25 16:17:46 EST 2006 | A.N.other
Hi, been researching archives for PCB composition. Nothing much for what I want. Can anyone direct me/advise of PCB composition, and I mean the full works. Content of base materials, solder resist, chemical compositions of epoxy etc. Much appreciat
Electronics Forum | Sun Feb 26 08:27:50 EST 2006 | davef
Start with: * Clark "Handbook of Printed Circuit Manufacturing * Coombs "Printed Circuits Handbook * Jawitz "Printed Circuits Board Materials Handbook
Used SMT Equipment | AOI / Automated Optical Inspection
Hardware composition: Ring LEDs (R, G, B) Image resolution 20µm Fixed shape, fixed substrate Single-phase power supply 100 to 240VAC ±10% The weight is below 500kg Equipment dimensions: 700W×900D×1600H mm (height
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Industry News | 2003-02-13 07:53:53.0
Belgian Laminate Plant Set to Come Online
Industry News | 2003-04-25 08:11:22.0
Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.
Parts & Supplies | Cleanliness Testers
Specification 55% cellulose and 45% polyester non-woven composite Weight 50,56,65, 68 grams per M2 Suitable for different kinds of SMT machines Application Machine Type SMT Silk Screen Roller Wipes Spec.(mm x m) Paper tube/PVC tube
Parts & Supplies | Screen Printers
Wiping paper size sheet for SMT stencil Material composition: 55% fiber, 45% Wood pulp Basic weight: 56g / m2 Machine model Specification（mm） Pipe Edge Opening MPM 19.5*250（455）*10 Hose with 12 inner grooves No 19.5*300（455）*10 19.5
Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
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Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Career Center | , Mississippi USA | Engineering,Production
About The Company: This company is a supplier of aerospace and defense products to the U.S. Government and its allies and major prime contractors. This company holds market leadership positions in munitions, smart weapons and precision capabilities
Career Center | Greenville, South Carolina USA | Engineering,Management,Production,Purchasing,Quality Control
Job Purpose Develop the next generation, leading edge products for GE Energy customers. As an Advanced Manufacturing Engineer supporting Gas Turbines, you will: Work in a highly cross-functional environment with Engineering, Manufacturing, Sourci
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
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