Industry Directory | Manufacturer
SMT JUKI spare parts and repair service.CyberOpitcs Laser,Juki,Samsung,Yamaha,DEK,Tenryu,Nozzles,Feeders,PWB,Motors.etc....
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
Electronics Forum | Tue Feb 03 11:02:13 EST 2015 | dekhead
"DEK 265" can mean many things; need to be clear on what machine type. www.dekhead.com
Used SMT Equipment | Screen Printers
2003 DEK Horizon 01 Screen Printer *** Note: This lot contains two items. (1) DEK Horizon 01 Screen Printer (1) DEK VF35 Vacuum System Approx Dimensions: 70" x 70" x 68" Location: Jasper, IN USA Serial: 281505 Features: o Advantec 2.05 Computer syste
Used SMT Equipment | Soldering - Reflow
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature. Complete Computer Control System including: Flat Panel
Industry News | 2018-09-06 12:12:07.0
GPD Global offers the ideal tabletop robots (Catalina Series) for precision dispensing.
Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
Parts & Supplies | SMT Equipment
DEK spare part “IBUS host computer Part number :191543
Parts & Supplies | SMT Equipment
IBUS host computer(191543/200880) of DEK Applicable models:ELA-I HOZ02-I HOZ03-IX INFAPI
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Live Demo of the SRT Sierra 1000 BGA Rework Station. Tune in, watch, learn and ask questions about BGA Rework Stations, BGA Rework Services, BGA Reballing and more! http://www.pcb-repair.com/bga-rework-station/
SMT Reflow Ovens for PCB Soldering ❙ Introduce of Reflow Soldering Oven High quality SMT reflow ovens, PCB soldering oven machine, lead-free reflow oven, for PCB soldering. ETA SMT machines manufacturers offers from 6-12 zones good price ref
Events Calendar | Tue Jun 02 00:00:00 EDT 2020 - Thu Jun 04 00:00:00 EDT 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Events Calendar | Tue Jun 14 00:00:00 EDT 2022 - Wed Jun 15 00:00:00 EDT 2022 | Toronto, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Career Center | Orlando, Florida USA | Technical Support
We are looking to add another person to our team. Looking for somoene with a broad base of technical knowledge. Currently somoene that has experience working on some of the following would be a huge plus : Juki Mydata Siemens Universal
Career Center | , India | Maintenance,Technical Support
Candidates with a degree or diploma in electronic engineering and have 1+ year experience in repairing work of PC Motherboard or Monitor PCB and from Indian subcontinent can apply for the posts. email:origin_computer@yahoo.com
Career Center | Ballston Spa, New York USA | Engineering,Maintenance,Production,Purchasing,Quality Control,Research and Development,Sales/Marketing,Technical Support
Qualifications / Skills: Maintain and repair X-Ray inspection equipment Maintain Surface Mount Manufacturing Systems Full DEK OEM equipment training Train Surface Mount Technology, Semiconductor, and Solar Photovoltaic operators and engineers Mainta
Career Center | Wayland, Michigan USA | Engineering,Maintenance,Research and Development,Technical Support
-Young, energetic, and eager individual ready and willing to learn new skills and exercise my current skill set. -Trained and proficient in the following pieces of equipment: MyData Pick and Place, Dek screen printers, Cyberoptic and Koh Young SPI,
SMTnet Express, July 17, 2014, Subscribers: 22938, Members: Companies: 13943, Users: 36480 Enhancing Thermal Performance in Embedded Computing for Ruggedized Military and Avionics Applications. Darren Campo, Jens Weyant, Bryan Muzyka; Advanced
GPD Global | https://www.gpd-global.com/pdf/doc/FLOware-Software-Guide-Addendum-Computer-Controls.pdf
2.9.3S This addendum includes content destined for the FLOware Software User Guide, PN 22100080D in the following sections: • Getting Started - User Interface - Computer Control with KVM Computer Control with KVM The dispense system KVM switch lets you easily change between multiple computers using a single set of KVM
Heller Industries Inc. | https://hellerindustries.com/parts/4101/
4101 - SFF DESKTOP COMPUTER Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
