New Equipment | Cable & Wire Harness Equipment
Overview The HotStamp 4140 is designed for economical high quality marking of wires, cables and tubing. Character combinations and character sizes are freely selectable. Although primarily used for marking wires and cables, the HotStamp 4140 is sui
[type number] DL [power] (W) 10W-1200W [the maximum output voltage (kV)], 1,2,3,5,8,10,15,20,30,40,50,60,80100120130, Weisman DL series is a high performance 19 'standard rack type high voltage power supply, DL series has a perfect protection syst
Electronics Forum | Wed Nov 13 09:27:42 EST 2013 | zrunkle_api
Thanks I will give that a Try.
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Industry News | 2012-02-28 19:55:52.0
Count On Tools has added a Laser Marking & Engraving capability to its manufacturing operations at its facility in Gainesville, GA. The recent expansion is in response to the growing market for SMT nozzles and consumables as well as the increased demand for its precision contract machining services.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/applicators/ecoliner-compound-gun
. Combines a tapered, concave needle/nozzle design with fast air-open/close actuation to resist material build-up An integrated needle-stroke adjustment permits accurate control of material volume and pattern repeatability
