Industry Directory: conductive compounds (6)

Conductive Compounds, Inc.

Industry Directory | Manufacturer

Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.

Intek Adhesives Ltd

Industry Directory |

Supply of High temperature adhesives and thermally conductive RTV silicones, sealants, potting compounds, cyanoacrylates, solders and solder pastes, heat sink grease, epoxy resins

New SMT Equipment: conductive compounds (52)

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

Electronics Forum: conductive compounds (23)

Conductive inks standards

Electronics Forum | Tue Sep 28 17:20:14 EDT 2004 | davef

We're aware of no such standard. Check with ink suppliers [eg, Conductive Compounds, Coats Circuit Products, Creative Materials, etc] to confirm.

Affect of Solder Mask on Heat Dissipation

Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef

Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co

Industry News: conductive compounds (69)

Largest Dispensing Platform in the Industry

Industry News | 2017-04-11 21:19:32.0

GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.

GPD Global

Printed Electronics Coming of Age at IPC APEX EXPO 2012

Industry News | 2012-02-07 00:51:20.0

A key enabling technology that is making a significant impact in consumer, commercial, medical and specialty electronics markets, printed electronics is coming of age at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. IPC APEX EXPO will feature a dedicated printed electronics area on the show floor, a printed electronics track in the technical conference, and historic standards development meetings where the first-ever industry requirements for the manufacture and assembly of printed electronics will be discussed and developed.

Association Connecting Electronics Industries (IPC)

Technical Library: conductive compounds (3)

Metal-based Inkjet Inks for Printed Electronics

Technical Library | 2014-12-04 18:27:40.0

A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.

Hebrew University of Jerusalem

Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders

Technical Library | 2018-05-17 11:14:52.0

Intermetallic compound (IMC) growth is being studied in earnest in this past decade because of its significant effect the solder joint reliability. It appears that from numerous investigations conducted, excessive growth of IMC could lead to solder joint failure. Leading to this, many attempts has been made to determine the actual IMC thickness. However, precise and true representation of the growth in the actual 3D phenomenon from 2D cross-section investigations has remained unclear. This paper will focus on the measuring the IMC thickness using 3D surface profilometer (Alicona Focus G4). Lead free solder, Sn3.0Ag0.5Cu (SAC305) was soldered onto copper printed circuit board (Cu PCB). The samples were then subjected to thermal cycle (TC) storage process with temperature range from 0 °C to 100 °C for 200 cycles and up to 1000 cycles were completed.

Universiti Kebangsaan Malaysia

Videos: conductive compounds (1)

Contour Mapping for Precision Fluid Dispense

Contour Mapping for Precision Fluid Dispense

Videos

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

Events Calendar: conductive compounds (1)

CALCE Reliability Science Symposium - Spring 2020

Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA

CALCE Reliability Science Symposium - Spring 2020

CALCE Center for Advanced Life Cycle Engineering

Career Center - Jobs: conductive compounds (1)

Assembler 2 – IPC 610 – 2nd Shift

Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production

Job Title: Assembler 2 – IPC 610 – 2nd Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday –Thursday 3:30pm – 1:00am, Friday 2:30pm to 11:00pm Job Description: Performs a variety of dut

Lockheed Martin Corporation

Express Newsletter: conductive compounds (199)

SMTnet Express - May 17, 2018

SMTnet Express, May 17, 2018, Subscribers: 31,044, Companies: 10,939, Users: 24,723 Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders Azman Jalar, Maria Abu Bakar, Roslina Ismail, Abdul Razak Daud

Partner Websites: conductive compounds (183)

Fluid Dispensing for Large PCB, Pallets

GPD Global | https://www.gpd-global.com/co_website/news-events-pr-526.php

) and larger, the platform is excellent for larger format projects. DS Series handles up to three dispense pumps for application flexibility including two part mixing and dispense applications such as adhesives, solder paste, underfills, conductive adhesive, potting compounds, and more

GPD Global

Additive manufacturing: Future markets in electronics

| https://productronica.com/en/discover/trade-fair-topics/future-markets/

Production Cluster at productronica. In addition to the wide range of printers available, the focus will also be on technical developments in the integration of raw and construction materials such as metals or electrically conductive compounds


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