Industry Directory | Manufacturer
Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.
supplier of clad & pure nickel powders and conductive fillers; additives used in the formulation of thermally & electrically conductive polymers, elastomers (emi gaskets and seals) & plastics with rf emi shielding properties.
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
Our conductive silicone gaskets are constructed from silicone containing metal powder fillers which combine to produce high levels of attenuation with excellent environmental shielding and a high level of conductivity. Many types of filler, from nick
Electronics Forum | Wed Nov 10 04:51:15 EST 2004 | alanhayllar
That's great - thanks for the advice on the epoxy's. Can anyone provide any info on the single part thermally conductive adhesives or fillers that do not require an activator? Mant thanks.
Electronics Forum | Sat Nov 24 22:15:16 EST 2001 | Glenn Robertson
Tony, I'm not sure if even baking will stop the voids if you have gaps in the plating. It probably doesn't take much moisture or even trapped air. I'm not speaking from a lot of direct experience here, so please run the tests and let us know wh
Used SMT Equipment | Soldering Equipment/Fluxes
High speed solder paste dispensing • Rapid SMD prototyping and low volume production • Dispensing instead of printing • Saves cost for stencils • Fine pitch dispensing of solder paste or conductive glue • Integrated valve heating • Direct impor
Industry News | 2014-08-03 19:58:55.0
The SMTA announced that the Evolving Technologies Summit will be held on September 29, 2014 as a focused symposium at SMTA International in Rosemont, Illinois.
Industry News | 2022-05-05 17:28:46.0
Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste
Technical Library | 2007-11-01 17:16:07.0
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,
Technical Library | 2014-02-27 15:30:20.0
Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices
Rugged Material Feeding Unit for Highly Abrasive Dispensing Media With High Viscosity. Loading of Material From 20-Litre Drums With the Patented Scheugenpflug Barrel Follower Plate. The barrel (hobbock, pail) is positioned on the ergonomic hobbock d
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a MacDermid Performance Solutions Business, and a leader in providing global semiconductor packaging manufacturers with innovative, high performance materials, is seeking a Formulation Chemist for their Suwanee, GA Research
Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections. Influence of Nanoparticles, Low Melting
SMTnet Express, February 27, 2014, Subscribers: 22818, Members: Companies: 13775, Users: 35799 A Novel High Thermal Conductive Underfill For Flip Chip Appliation. Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Silicon dioxide
ORION Industries | http://orionindustries.com/pdfs/Electrically_conductive_poron.pdf
#180-034 EC-2000 SERIES CONDUCTIVE SILICONES High Performance Foams 171 West St. Charles Road Carol Stream, IL 60188-2081 Tel: 630.784.6200 / Fax: 630.784.6201 www.rogerscorporation.com Technical Data TYPICAL PROPERTIES Test Method Filler Base Polymer Specific Gravity, g/cc Thickness
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6006.html
.-/RETROFIT KIT SLEEVE IC-HEAD F5HM 00318323-02 COMPONENT-MAGAZINE LONG W7,6/H3,2/O-L5,0 00318324-02 COMPONENT-MAGAZINE LONG SO8/WIDE 00318352-02 NOZZLE TYPE 614 SOKO A 230 conductive 00318370S01
