Source for Masking Tapes to Electronic Industry. Products are Kapton Masking tape, Solder wave tape, Masking Disc
Industry Directory | Manufacturer's Representative
we export soft electromagnetic shielding materials
Conductive Foil Tapes Our range of conductive foil tape offers a cost-effective solution to EMC shielding. Tapes are available in both copper and aluminium with a conductive adhesive. The tapes can be used to seal joints on enclosures and for ground
Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating mo
Electronics Forum | Wed Feb 15 16:10:13 EST 2006 | slthomas
My understanding is that you get a reading that's the average of all of the jumped points if you jump tc wires with conductive tape. If you're doing multiple parts on a board with varying masses and don't control the attachment method (i.e., how mu
Electronics Forum | Wed Feb 15 14:03:25 EST 2006 | samir
Robert McKeown Company makes thermally conduct Al tape. KIC did a study on which method (Kapton Tape, Aluminum Tape, Hi-Temp Solder) is the most repeatable. The study can be found in their website: http://www.kicthermal.com Al Tape placed 2nd, and
Used SMT Equipment | Pick and Place/Feeders
FUJI-NXT III NXT III Scalable Placement Platforms The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips
Used SMT Equipment | Pick and Place/Feeders
FUJI-NXT III NXT III Scalable Placement Platforms The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
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Parts & Supplies | SMT Equipment
03006399-01 HOSE 6x4 Reject Placement Circuit 03006400-01 HOSE 8x5 Stop Circuit 03006405-01 DISTRIBUTOR APPLICATION HEAD COMPL. 03006411-02 CONTROL UNIT TAPE CUTTER HF 03006414-01 progr. FLASH CONTROL UNIT HF/X-Series 03006457-02 CALIBRATION UNI
Technical Library | 2022-09-29 14:08:42.0
Electronic vehicles, devices and components must not overheat, otherwise they may fail to operate correctly. Thermal management is a major technical challenge as components are getting smaller, power densities are increasing and demands on robustness and reliability are becoming more stringent. To prevent power losses or defects resulting from overheating, liquid thermal interface materials (TIMs) are being increasingly used to dissipate their heat. This White Paper discusses the aspects that need to be taken into account when dispensing these mostly highly viscous, highly abrasive materials and why in many cases they are better alternatives to pads, tapes and foils.
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
03006399-01 HOSE 6x4 Reject Placement Circuit 03006400-01 HOSE 8x5 Stop Circuit 03006405-01 DISTRIBUTOR APPLICATION HEAD COMPL. 03006411-02 CONTROL UNIT TAPE CUTTER HF 03006414-01 progr. FLASH CONTROL UNIT HF/X-Series 03006457-02 CALIBRATION UNI
Career Center | LaGrange, Ohio USA | Purchasing
JOB DESCRIPTION TITLE: Materials Manager DEPARTMENT:Materials SUPERVISOR:Vice President WORK HRS: 7.00 A.M. TO 3.30 P.M. DUTIES & RESPONSIBILITIES: Responsible for efficient, economical procurement and management of all raw materials
Career Center | , | Engineering,Maintenance,Technical Support
Dear Sir/Madam, I am having the 10 years exprience in SMT field. Currently I am working in Service industry as Senior Engineer. Specially I am exprience and trained in FUJI and Speedline machines. Earlier I worked with Manufacturing Industry.
Career Center | Bangalore, Karnataka India | Sales/Marketing
Dear Mam / Sir, Greetings, My 22 years of Sales & Business Development experience in “Capital Equipments” (Plastic processing m/c's, Turn-key packaging m/c’s, etc.) should be of interest to a fast growing company like yours. My experience in vario
GPD Global | https://www.gpd-global.com/co_website/peelforcetester.php
Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11098835-8kg-smt-spare-parts-pcb-magazine-loader-and-unloader-pcb-holder-rack-460mm-x-400mm-x-563mm.html
: length 460* width(100-330)mm Side guide slot: depth 3.5mm, width 5mm , pitch 10mm Materials: conductive side pannel, aluminum pillar ,zincification steel base
