Electronics Forum | Fri Sep 24 10:57:18 EDT 1999 | Earl Moon
| Hi Folks: | | We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. | | The bridging is happening after coming out of reflow...one la
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Industry News | 2011-08-08 16:05:12.0
IPC will begin development of a data exchange standard to help the electronics manufacturing industry comply with forthcoming U.S. Securities and Exchange Commission (SEC) regulations on conflict minerals at a kickoff meeting on September 22, 2011, held in conjunction with IPC Midwest Conference & Exhibition, Schaumburg, IL.
Industry News | 2013-08-14 11:48:01.0
IPC – Association Connecting Electronics Industries® will host one-day conference, “Conflict Minerals: Complying with EU and US Laws” on October 23, 2013, in Brussels to help European and U.S. companies plan for compliance with current and future customer and legal requirements.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
alloys with high reliability and reduced fragility will be presented. Electromigration and tin whisker will also be discussed. PDC07 Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy Cancelled
| https://ipcapexexpo.org/media/33/download
. Each staff liaison will work with committee leaders to select a time for their meeting, and following the SummerCom 2020 model, the meetings will be spread over a few weeks, so as not to conflict
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