We can help you eliminate rust, tarnish, corrosion, poor wetting and add years to your components or PC boards shelf-life. Dasal Technical Products, Inc. markets and distributes a state-of-the-art technology for the preservation and protection of met
We can help you elimante rust, tarnish, corrosion, poor wetting and years to your components and PC boards shelf-life. Dasal Technical Products, Inc. markets and distributes a state-of-the-art technology for the preservation and protection of metals.
Electronics Forum | Thu Jul 28 05:41:22 EDT 2005 | K
Hi guys, Have any of you encountered harwin connector M80-647 in the past? Have you noticed any problems with the reliability of the component, solderability and 'reworkability' (thats a new word for sure)? Heres a PDF of the component; http://www.
Electronics Forum | Tue Sep 24 11:10:07 EDT 2002 | Gregg Temkin
I�d appreciate assistance in trying to resolve a placement/soldering problem. My company has designed a board which uses a large number of 0402 LED�s that are .028� high. The LED�s need to be soldered so that they point straight up and are not til
Used SMT Equipment | In-Circuit Testers
Stanford Research DS360 Function Generators The performance of a low distortion analog source and the precision of direct digital synthesis (DDS) is combined in the DS360. With less than 0.001 % total harmonic distortion (THD), 25 ppm frequency a
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Parts & Supplies | Assembly Accessories
SMT MACHINE SPARE PARTS JUKI RS-1 NOZZLE ASSEMBLY 7505 40183425 JUKI Nozzle Specifications: Brand Name JUKI RS-1 NOZZLE Part Number 40183425 Model JUKI NOZZLE 7502 7503 7504 7505 7506 Ensure Test in machine confirmation Guarantee 1 month
Parts & Supplies | SMT Equipment
Panasonic smt nozzles models: Panasonic MSR SMT NOZZLE Part Number Description 10468S0002 MSR - SMT NOZZLE - VVS (0.84 X 0.60) 10468S0003 - NZ. - VS (1.0 X 0.64) 10468S0004 -NZ. - S (1.6 X 1.06) 1046710134 -NZ. - M (1.60mm) 10467S0001 -NZ. - L
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
![[SEC] 3D In-line AXI Solution X-eye 6300 X-ray Inspection Machine](https://img.youtube.com/vi/w-_v-XDRKro/sddefault.jpg)
3D In-line Automated X-ray Inspection system (machine) Model: X-eye 6300 X-ray Tube: 160kV / 500 µa Table Size: Max. 330 x 250mm Min. 50 x 50mm Detector: 12 inch FPXD Defection type (Application): BGA, PoP, chip, QFN, QFP, etc. - High-speed In-lin
Career Center | Oldsmar, Florida USA | Maintenance,Production
Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/fittings-and-connectors?con=t&page=4
. Utilize tamper-evident industrial fittings such as our BioClamps or PharmaLok clamps to simplify single-use applications. Industrial connector solutions like Nordson’s Quick Connect
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smt-headers_topic736.html
defines preferences for padstacks and outlines and applies their preferences to the holes and outline to auto-generate the footprint. The “Package Editor” will be able to create any through-hole connector or electronic package. The Package Editor will be
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