Industry Directory | Manufacturer
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments.
Industry Directory | Manufacturer
Custom High Density Flex Circuit Process Design and Manufacturing In Days, not Weeks.
When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time
Discover the new Nokia 8800 phone. Created for your ultimate pleasure, its graceful looks and seamless functions will leave a lasting impression. Every aspect has been meticulously considered and precisely engineered; from the laser-cut curves of its
Electronics Forum | Fri Nov 30 11:49:20 EST 2007 | nkb2400
If the goal is selective soldering (not to raise the substrate temperature too high), consider the use of microwaves. Our company has been working on this technology for selectively bonding substrates. For example, we use the process to bond ROHS met
Electronics Forum | Fri Jun 15 16:48:05 EDT 2012 | esoderberg
we are considering laser marking all boards in a panel with a unique identifier that will eventually tie in all the component data used on the board. We were wondering what numbering schemes are used in our industry other than a unique MSN (manufactu
Industry News | 2012-08-08 17:44:58.0
IPC Recently released, IPC-7527 was the brainchild of Task Group Nordic (TGNordic), IPC’s volunteer standards development group in Scandinavia.
Industry News | 2012-12-13 13:23:38.0
IPC-7527, Krav til Tinpastatryk, is also the first standard ever developed that focuses on the application of one of the industry’s most basic infrastructure elements, solder paste.
Technical Library | 2008-04-15 14:43:08.0
The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges.
Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences
Technical Library | 2024-11-26 16:43:34.0
A review of factors to consider when evaluating the depanel of a PCB and what you should consider when making a decision on the best process for your project.
ETA Pyxis Series CBS Reflow Oven If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Reflow Oven, Reflow Soldering, Reflow Soldering Oven,
SunzonTech can provider lots kind of smt conveyor with highly customized. This vedio shows our workshop when producing smt conveyor.
Career Center | Ft Wayne, Indiana USA | Management,Production,Quality Control
Metal Etching Technology Inc. is one of the United States leading manufacturers of solder paste stencils for the electronics industry. Candidate's main responsibility will be to run a stencil laser cutting system for the printed circuit board indus
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As in any process and operation, making the NPI procedure as simple as possible is a desirable prospect. So here are the underlying factors that can be considered when efforts are required to be implemented. Personnel
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Cleaning Machine Stencil Cleaning Machine PCB Protector PCBA Coating Machine Automatic Dispensing Machine Glue Potting Machine I.C.T Curing Oven IR Curing Oven UV Curing Oven Traceability Equipment Automatic Laser Marking Machine Automatic Label Mounter Automatic Inkjet Printing Machine Benchtop Robot Soldering Robot Screwing
